A thin film transistor, comprising a substrate, an active layer disposed on the substrate, and a source and drain that make electrical contact with the active layer, wherein the source and drain each comprise a first sub-electrode and a second sub-electrode that are stacked along a thickness of the active layer, and the first sub-electrode is closer to the active layer relative to the second sub-electrode. An area of an overlapping region between an orthographic projection of the second sub-electrode of at least one of the source and drain on the substrate and an overlapping region between an orthographic projection of the first sub-electrode of the at least one of the source and the drain on the substrate and the orthographic projection of the active layer on the substrate.

A semiconductor device with high design flexibility is provided. A first transistor and a second transistor having electrical characteristics different from those of the first transistor are provided over the same layer without significantly increasing the number of manufacturing steps. For example, semiconductor materials with different electron affinities are used for a semiconductor layer in which a channel of the first transistor is formed and a semiconductor layer in which a channel of the second transistor is formed. This allows the threshold voltages of the first transistor and the second transistor to differ from each other. Forming a gate electrode using a damascene process enables miniaturization and high density of the transistors. Furthermore, a highly-integrated semiconductor device is provided.

A display apparatus includes a base substrate, an active pattern disposed on the base substrate, a gate insulation layer disposed on the active pattern, a gate electrode disposed on the gate insulation layer and overlapping the active pattern, a first insulation layer disposed on the gate electrode and having a total amount of hydrogen of about 5 atomic percent (at. %) to about 30 at. %, and a source electrode and a drain electrode which are disposed on the first insulation layer and are electrically connected to the active pattern.

An array substrate, a display panel and a display device are disclosed. The array substrate includes a display region and a non-display region around the display region, and further includes: a first leading wire extending from the non-display region to the display region and a second leading wire extending from the non-display region to the display region. The first leading wire is between a first signal line and a first fan-out line and electrically connects the first signal line and the first fan-out line, and the second leading wire is between a second signal line and a second fan-out line and electrically connects the second signal line and the second fan-out line. The first leading wire and the second leading wire are in different layers.

The present disclosure relates to an array substrate and a manufacturing method thereof, a display device. The manufacturing method of the array substrate includes: upon manufacturing of a gate layer, connecting a gate line in the gate layer with a signal line electrically; and after manufacturing of an active layer is completed, disconnecting electrical connection of the gate line with the signal line.

The present disclosure provides a thin film transistor, a display substrate, a method for preparing the same, and a display device including the display substrate. The method for preparing the thin film transistor includes: forming an inorganic insulating film layer in contact with an electrode of the thin film transistor by a plasma enhanced chemical vapor deposition process at power of 9 kW to 25 kW, at a temperature of 190° C. to 380° C. and by using a mixture of gases N.sub.2, NH.sub.3 and SiH.sub.4 in a volume ratio of N.sub.2:NH.sub.3:SiH.sub.4=(10˜20):(5˜10):(1˜2), such that a stress value of the inorganic insulating film layer is reduced to be less than or equal to a threshold, and the inorganic insulating layer comprises silicon nitride.

Provided are a thin film transistor substrate and a display using the same. A display includes: a first thin film transistor, the first thin film transistor including: a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode, a second thin film transistor, the second thin film transistor including: a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode, an intermediate insulating layer including a nitride layer and an oxide layer on the nitride layer, the intermediate insulating layer being disposed on the first gate electrode and the second gate electrode and under the oxide semiconductor layer, and an etch-stopper layer disposed on the oxide semiconductor layer.

A thin film transistor includes an oxide semiconductor layer including a channel region, and a source region and a drain region having a resistivity lower than that of the channel region; a gate insulating layer disposed on the channel region of the oxide semiconductor layer; a gate electrode disposed on the gate insulating layer; and an aluminum oxide layer covering the lateral surface of the gate insulating layer, and the source region and the drain region, wherein the gate insulating layer has a multi-layer structure including a first insulating layer and a second insulating layer, and the first insulating layer contains silicon oxide as a main component, and is disposed on and in contact with the channel region.

In an electro-optical device, a relay electrode (first electrode) includes a conduction section that overlaps the projection portion of an inter-layer insulation film, and the conduction section is exposed from the surface (flat surface) of the inter-layer insulation film. An insulation film which has a film thickness thinner than the height of the projection portion is formed on the surface (flat surface) of the inter-layer insulation film, and a pixel electrode is electrically conducted to the conduction section through the opening of the insulation film. In this case, since the opening is shallow, a large uneven part is hardly generated on the surface of the pixel electrode.

The present invention provides a TFT backplate structure and a manufacture method thereof. The TFT backplate structure comprises a switch TFT (T1) and a drive TFT (T2). The switch TFT (T1) is constructed by a first source/a first drain (61), a first gate (21), and a first etching stopper layer (51), a first oxide semiconductor layer (41), a first gate isolation layer (31) sandwiched in between. The drive TFT (T2) is constructed by a second source/a second drain (62), a second gate (22), and a second oxide semiconductor layer (42), a first etching stopper layer (51), a second gate isolation layer (32) sandwiched in between. The electrical properties of the switch TFT (T1) and the drive TFT (T2) are different. The switch TFT has smaller subthreshold swing to achieve fast charge and discharge, and the drive TFT has relatively larger subthreshold swing for controlling the current and the grey scale more precisely.