A display device includes transistors disposed on a substrate, a first protective layer covering the transistors, conductive patterns disposed on the first protective layer, a second protective layer disposed on the conductive patterns, first and second electrodes disposed on the second protective layer, at least one light emitting disposed between the first and second electrodes, and a first contact electrode disposed on the first electrode and contacting an end of at least one light emitting element, and a second contact electrode disposed on the second electrode and contacting another end of the at least one light emitting element. The conductive patterns include first and second conductive patterns respectively overlapping the first and second electrodes. The first electrode is connected to the first conductive pattern. The second protective layer includes an opening hole exposing a portion of the second conductive pattern.

A display device according to one embodiment of the present disclosure may include a substrate including a plurality of concave portions, light emitting elements disposed at the plurality of concave portions, a first insulating layer disposed on the substrate and the light emitting element, a transistor disposed on the first insulating layer and including an active electrode and a gate electrode, a first hole included in the active electrode, a second hole included in the first insulating layer, and a connection electrode disposed in the first hole and the second hole, wherein the light emitting element may be electrically connected to the active electrode by the connection electrode.

A display backplane is provided, including a base, wherein pixel circuits, bonding electrodes, and bonding connection wires are on the base; the bonding electrodes are coupled to the bonding connection wires in a one-to-one correspondence; the bonding electrodes and the bonding connection wires are on two opposite surfaces of the base; the pixel circuits and the bonding connection wires are on a same side of the base; one end of each bonding connection wire is coupled to the bonding electrode through the first via in the base; the other end of each of at least some bonding connection wires is coupled to the pixel circuit; and an orthographic projection of at least one of the bonding electrodes and the bonding connection wires on the base is not coincident with an orthographic projection of the pixel circuit on the base.

A display substrate, a method of manufacturing the display substrate, and a display device are provided. The display substrate includes: a base substrate, a plurality of sub-pixels, a gate driving circuit, a plurality of input contact pads, a plurality of output contact pads and a contact pad insulating layer. Surfaces of the input contact pads away from the base substrate and surfaces of the output contact pads away from the base substrate are exposed from the contact pad insulating layer. The contact pad insulating layer includes a first portion having a first thickness and a second portion having a second thickness smaller than the first thickness. Edges of the input contact pads and edges of the output contact pads are covered by the first portion. The second portion is located in the region between the input contact pads and the output contact pads.

The display substrate includes: a first electrode located in a first display region and a second electrode located in a second display region; a first light emitting layer located in the first display region and a second light emitting layer located in the second display region; and a third electrode located in the first display region and a fourth electrode located in the second display region. By optimizing patterned design of the third electrode, a first electrode wiring mode in the first display region is optimized, so that a display effect in the first display region is improved, glare interference is reduced, the transmittance of the first display region is optimized and improved, and a photographing effect of an under-screen camera configured in the first display region is ensured.

A display panel includes a display area which includes a center area and a corner area arranged at a corner of the display panel, where a plurality of pixels is arranged in the corner area, and a non-display area arranged outside the display area. The corner area includes a central corner area including a plurality of extension areas each extending in a direction away from the center area and at least partially separated from each other, a first adjacent corner area adjacent to the central corner area, and a second adjacent corner area spaced apart from the first adjacent corner area with the central corner area therebetween, and the non-display area includes a bypass area extending from the first adjacent corner area to the second adjacent corner area to at least partially surround the central corner area.

Provided are a display apparatus includes: a substrate having a main display region, a first auxiliary display region adjacent to the main display region in a first direction, a second auxiliary display region spaced apart from the main display region having the first auxiliary display region therebetween, an intermediate display region adjacent to the first auxiliary display region and the second auxiliary display region; a first auxiliary pixel electrode arranged in the first auxiliary display region and having an elliptical shape having a long axis and a short axis; a second auxiliary pixel electrode arranged in the second auxiliary display region; and a first auxiliary pixel circuit and a second auxiliary pixel circuit arranged in the intermediate display region and respectively electrically connected to the first auxiliary pixel electrode and the second auxiliary pixel electrode, wherein a long axis of the first auxiliary pixel electrode extends in a second direction intersecting with the first direction.

A method of fabricating a conductive pattern includes forming a conductive metal material layer and a conductive capping material layer on a substrate, forming a photoresist pattern as an etching mask on the conductive capping material layer, forming a first conductive capping pattern by etching the conductive capping material layer with a first etchant, forming a conductive metal layer and a second conductive capping pattern by etching the conductive metal material layer and the first conductive capping pattern with a second etchant, and forming a conductive capping layer by etching the second conductive capping pattern with a third etchant. The second conductive capping pattern includes a first region overlapping the conductive metal layer and a second region not overlapping the conductive metal layer, and the forming of the conductive capping layer includes etching the second region of the second conductive capping pattern to form the conductive capping layer.

A display apparatus having a connection electrode which crosses a bending area may be provided. The connection electrode may be disposed on a device substrate including a bending area between a display area and a pad area. The connection electrode may connect the display area and the pad area across the bending area. The connection electrode may have a stacked structure of the lower connecting electrode and the upper connecting electrode. A light-emitting device, an encapsulating element and a touch electrode may be sequentially stacked on the display area of the device substrate. The upper connecting electrode may include the same material as the touch electrode. Thus, in the display apparatus, the disconnection of the connection electrode due to bending stress and external impact may be reduced.

A thin film transistor, a method for manufacturing the same and a display apparatus comprising the same are disclosed, in which the thin film transistor comprises a semiconductor formed on a substrate, a gate insulating film formed on the semiconductor, a gate electrode formed on the gate insulating film, a first insulating film formed on the substrate, a first conductor portion formed on the first insulating film and formed at one side of the semiconductor, and a second conductor portion formed on the first insulating film and formed at another side of the semiconductor, wherein a first portion of the first insulating film may be formed between the semiconductor and the first conductor portion, and a second portion of the first insulating film may be formed between the semiconductor and the second conductor portion.