A display module including a glass substrate; a thin film transistor layer disposed in a first area of the glass substrate; a plurality of connection pads disposed in a second area extending from the first area of the glass substrate and electrically connected to the thin film transistor layer; a plurality of test pads disposed in a third area extending from the second area of the glass substrate and electrically connected to the plurality of connection pads, respectively, and a plurality of connection wirings electrically connecting the plurality of connection pads and the plurality of test pads.

A display apparatus includes a substrate including a display area and a non-display area disposed around the display area, a driving circuit disposed in the non-display area, a first conductive line extending in a first direction and disposed in the non-display area, a second conductive line extending in the first direction and disposed on the first conductive line, and a third conductive line extending in the first direction and disposed on the second conductive line, wherein the second conductive line overlaps the first conductive line by a first width or is spaced apart from the first conductive line by a first distance in a plan view, and the third conductive line overlaps the first conductive line by a second width or is spaced apart from the first conductive line by a second distance in the plan view.

A display device includes a first active pattern, a first conductive pattern including a gate electrode overlapping the first active pattern, a first gate line overlapping the first active pattern and extending in a first direction, and a second gate line extending in the first direction, a second conductive pattern disposed on the first conductive pattern and including a third gate line extending in the first direction and a fourth gate line extending in the first direction, a second active pattern disposed on the second conductive pattern and including a material different from a material of the first active pattern, and a third conductive pattern disposed on the second active pattern and including a first upper electrode overlapping the third gate line and connected to the third gate line, and a second upper electrode overlapping the fourth gate line and connected to the fourth gate line.

A display substrate and a manufacturing method, and a display device are provided. The display substrate includes a base substrate including a display region and a periphery region; and a shift register unit, a first power line and a second power line; an orthographic projection of the first power line on the base substrate is on a side of an orthographic projection of the shift register unit on the base substrate closer to the display region, an orthographic projection of the second power line on the base substrate is on a side of the orthographic projection of the shift register unit on the base substrate away from the display region, and the orthographic projection of the shift register unit on the base substrate is between the orthographic projection of the first power line on the base substrate and the orthographic projection of the second power line on the base substrate.

A display panel includes a base substrate, a display area and a non-display area provided on the base substrate; a data line is provided in the display area and a detection line is provided in the non-display area on the base substrate; and the detection line is electrically connected to a data line and is formed by overlapping a plurality of wire segments. A method of manufacturing a display panel, and a display device are further disclosed.

A display may have an array of pixels such as liquid crystal display pixels. The display may include short pixel rows that span only partially across the display and full-width pixel rows that span the width of the display. The gate lines coupled to the short pixel rows may extend into the inactive area of the display. Supplemental gate line loading structures may be located in the inactive area of the display to increase loading on the gate lines that are coupled to short pixel rows. The supplemental gate line loading structures may include data lines and doped polysilicon that overlap the gate lines in the inactive area. In displays that combine display and touch functionality into a thin-film transistor layer, supplemental loading structures may be used in the inactive area to increase loading on common voltage lines that are coupled to short rows of common voltage pads.

It is an object of the present invention to form a pixel electrode and a metal film using one resist mask in manufacturing a stacked structure by forming the metal film over the pixel electrode. A conductive film to be a pixel electrode and a metal film are stacked. A resist pattern having a thick region and a region thinner than the thick region is formed over the metal film using an exposure mask having a semi light-transmitting portion. The pixel electrode, and the metal film formed over part of the pixel electrode to be in contact therewith are formed using the resist pattern. Accordingly, a pixel electrode and a metal film can be formed using one resist mask.

Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed.

To provide a miniaturized semiconductor device with low power consumption. A method for manufacturing a wiring layer includes the following steps: forming a second insulator over a first insulator; forming a third insulator over the second insulator; forming an opening in the third insulator so that it reaches the second insulator; forming a first conductor over the third insulator and in the opening; forming a second conductor over the first conductor; and after forming the second conductor, performing polishing treatment to remove portions of the first and second conductors above a top surface of the third insulator. An end of the first conductor is at a level lower than or equal to the top level of the opening. The top surface of the second conductor is at a level lower than or equal to that of the end of the first conductor.

An array substrate includes a glass substrate GS, an alignment mark 29, and first traces 19. The glass substrate GS has a corner portion 30 having an outline defined by a first edge portion 11b1 and a second edge portion 11b2 crossing the first edge portion 11b1. The alignment mark 29 is disposed at the corner portion 30 and used as the positioning index in mounting a driver 21 and a flexible printed circuit board 13. The alignment mark 29 at least includes first and second side portions 29a, 29b parallel to the first and second edge portions 11b1, 11b2, respectively. One end of the second side portion 29b is continuous to one end of the first side portion 29a. The alignment mark 29 has an outline that is on a same plane with a reference line BL connecting other ends of the first side portion 29a and the second side portion 29b linearly. The first traces 19 include inclined portions 31 that are inclined with respect to the first and second side portions 29a, 29b along the reference line BL.