A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

An array substrate having a plurality of subpixels is provided. In a respective one of the plurality of subpixels, the array substrate includes a base substrate; and a thin film transistor on the base substrate. The thin film transistor includes a gate electrode, a source electrode, and a drain electrode. The drain electrode includes a first portion, a second portion, and a third portion connecting the first portion and the second portion. An orthographic projection of the first portion on the base substrate at least partially overlaps with an orthographic projection of a first gate line protrusion of a respective one of the plurality of gate lines on the base substrate. An orthographic projection of the second portion on the base substrate at least partially overlaps with an orthographic projection of a second gate line protrusion of the respective one of the plurality of gate lines on the base substrate.

An array substrate includes a substrate, a gate line on the substrate, a sub-pixel, two data lines, a touch signal line, a functional electrode, and a touch electrode unit. The orthographic projection of the touch signal line on the substrate partially overlaps orthographic projection of an opening area of the sub-pixel on the substrate; the touch electrode unit is coupled to the touch signal line; the extension directions of the first and second sub-function electrode portions of the functional electrode are the same as that of the data line, the first/second sub-functional electrode portion is located on a first/second side of the sub-pixel opening area; along the extending direction of the gate line, a distance between the first/second sub-functional electrode portion and the touch signal line is smaller than a distance between the data line on the first/second side and the touch signal line.

The present disclosure provides a novel form of a display device which enables semiconductor light emitting elements having a vertical structure to be assembled onto a substrate and then wiring process to be performed stably without any change to the position of the elements during post-processing. The display device according to one embodiment of the present disclosure comprises: a substrate; a pair of assembly electrodes positioned on the substrate; a dielectric layer positioned on the assembly electrodes; a wiring electrode positioned on the dielectric layer and comprising a base electrode part and a low melting point junction; a partition wall which overlaps with a portion of the wiring electrode, is positioned on the dielectric layer, and defines an assembly groove to which a semiconductor light emitting element is assembled; and the vertical semiconductor light emitting element which is assembled in the assembly groove and is electrically connected to the low melting point junction of the wiring electrode, wherein the low melting point junction has a flow stop angle for controlling the thermal flow characteristic of the junction.

An array substrate, a display panel and methods of manufacturing the same are provided. The method of manufacturing an array substrate according to an embodiment of the present disclosure includes: forming f pixel electrodes and a conductive structure on a substrate through a patterning process, wherein the pixel electrodes arranged in a first direction are connected through the conductive structure; and forming a signal line on the substrate through a patterning process, wherein the signal line and the pixel electrodes are disposed in the same layer. By means of the array substrate according to the embodiments of the present disclosure, the problem that it is not easy to discover the point defects caused by short circuit between the signal line and pixel electrodes in the related art can be solved.

The present invention is for a backplane substrate including an in-cell type touch panel advantageous to reducing the number of masks and the number of processes, a liquid crystal display device including the same, and a method of manufacturing the same, includes a plurality of interlayer dielectric layers disposed above a drain electrode of a thin film transistor are simultaneously patterned after forming a sensing line and a common electrode.

The disclosure relates to an array substrate. The array substrate may include a base substrate, an auxiliary electrode, a thin film transistor, a first insulating layer, a first electrode, a second insulating layer, and a second electrode sequentially arranged in a direction away from the base substrate. The auxiliary electrode is between the first insulating layer and the second insulating layer and insulated from the first electrode, the auxiliary electrode is coupled to a drain of the thin film transistor through a first via hole in the first insulating layer, and the second electrode is coupled to the auxiliary electrode through a second via hole in the second insulating layer.

A display device includes a substrate, a first semiconductor layer on the substrate, a first gate insulating film on the first semiconductor layer, a first conductive layer on the first gate insulating film and including a first gate electrode and a first electrode of a capacitor connected to the first gate electrode, a second semiconductor layer on the first gate insulating film and at a different layer from the first semiconductor layer, a second gate insulating film on the first conductive layer and the second semiconductor layer, a second conductive layer on the second gate insulating film and including a second gate electrode and a second electrode of the capacitor, a second interlayer insulating film on the second conductive layer, and a third conductive layer on the second interlayer insulating film and including a first source electrode, a first drain electrode, a second source electrode, and a second drain electrode.

A substrate processing apparatus includes a first process chamber in which a target substrate is processed, a first tank connected to the first process chamber to supply a first chemical to the first process chamber, a second process chamber in which the target substrate is processed, and a second tank connected to the second process chamber to supply a second chemical to the second process chamber. A metal ion contained in the first chemical supplied to the first process chamber has an ion concentration greater than an ion concentration of the metal ion contained in the second chemical supplied to the second process chamber.

An array substrate has a display area and a bonding area located on a side of the display area. The array substrate includes a base, a plurality of first transistors, a plurality of conductive pins and a plurality of conductive electrodes. The plurality of first transistors are disposed on a side of the base and located in the display area; a first transistor includes a first gate, a first source and a first drain. The plurality of conductive pins are disposed on the side of the base and located in the bonding area, and are disposed in a same layer as the first gate. The plurality of conductive electrodes are each disposed on a respective one of surfaces of the plurality of conductive pins away from the base.