The present invention relates to a nano-scale light-emitting diode (LED) element for a horizontal array assembly, a manufacturing method thereof, and a horizontal array assembly including the same, and more particularly, to a nano-scale LED element for a horizontal array assembly that can significantly increase the number of nano-scale LED elements connected to an electrode line, facilitate an arrangement of the elements, and implement a horizontal array assembly having a very good electric connection between an electrode and an element and a significant high quantity of light when a horizontal array assembly having the nano-scale LED elements laid in a length direction thereof and connected to the electrode line is manufactured, a manufacturing method thereof, and a horizontal array assembly including the same.

A chip arranging method for arranging a plurality of chips on a wafer includes a groove forming step of forming a plurality of intersecting grooves that mark off each of chip placement regions on the front surface side of the wafer, a liquid supplying step of supplying a liquid to the chip placement regions, a chip placing step of placing the chips on the liquid to position the chips in the chip placement regions by the surface tension of the liquid after carrying out the liquid supplying step, and a liquid removing step of removing the liquid to arrange the plurality of chips on the wafer after carrying out the chip placing step.

Embodiments are related to substrates having one or more well structures each exhibiting substantially vertical sidewalls and substantially planar bottoms.

A display device and a method of manufacturing the same are provided. The display device comprises a first area which extends in a first direction, a second area which extends in the first direction and is alongside the first area in a second direction intersecting the first direction, at least one first light emitting element in the first area, at least one second light emitting element in the second area, at least one first wiring coupled to an end of the first light emitting element in the first area and that extends in the first direction and at least one second wiring coupled to an end of the second light emitting element in the second area and that extends in the first direction, wherein the first wiring and the second wiring are electrically isolated from each other.

Embodiments of the invention relate generally to directed self-assembly (DSA) and, more particularly, to the DSA of electronic components using diamagnetic levitation.

A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic assembly.

Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.

A display apparatus includes a substrate, a first electrode on the substrate, the first electrode including a first portion that has a flat upper surface and a second portion that protrudes from the first portion and has an inclined surface, a second electrode facing the first electrode in parallel on the substrate, the second electrode including a first portion that has a flat upper surface and a second portion that protrudes from the first portion and has an inclined surface, and a plurality of light-emitting devices separate from each other on the first electrode and the second electrode, the light-emitting devices each having a first end contacting the upper surface of the first portion of the first electrode and a second end contacting the upper surface of the first portion of the second electrode.

An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region of the substrate, the first soldered joint having one or more intermetallic phases throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the first semiconductor die and the first metal region of the substrate; and a second semiconductor die soldered to the first or different metal region of the substrate.