An imaging device includes a plurality of photodiodes arranged in a photodiode array to generate charge in response to incident light. The plurality of photodiodes includes first and second photodiodes. A shared floating diffusion receives charge transferred from the first and second photodiodes. An analog to digital converter (ADC) performs a first ADC conversion to generate a reference readout in response to charge in the shared floating diffusion after a reset operation. The ADC is next performs a second ADC conversion to generate a first half of a phase detection autofocus (PDAF) readout in response to charge transferred from the first photodiode to the shared floating diffusion. The ADC then performs a third ADC conversion to generate a full image readout in response to charge transferred from the second photodiode combined with the charge transferred previously from the first photodiode in the shared floating diffusion.

An image sensor is provided. The image sensor includes a pixel array in which a plurality of pixels are arranged, wherein each of the plurality of pixels includes a photodiode; a floating diffusion node configured to integrate photocharges generated in the photodiode; a first sampling transistor electrically connected to a first node; a first capacitor electrically connected to a first node and configured to store a charge corresponding to a voltage of the floating diffusion node which is reset; a second sampling transistor electrically connected to a second node; a second capacitor electrically connected to the second node and configured to store a charge corresponding to a voltage of the floating diffusion node in which the photocharges are integrated; and at least one mode transistor configured to adjust an equivalent capacitance of each of the first node and the second node according to a mode control signal.

A photodetector comprises a semiconductor substrate having an input surface for receiving illumination, control electrodes for control of photogenerated charge within the substrate and a filter on the radiation input surface of the substrate, the filter comprising a dielectric-metal band pass filter having a metal layer and one or more dielectric layers with one dielectric layer between the substrate surface and the metal layer. A connector is provided for applying a bias voltage to the metal layer with respect to the substrate. In effect, the metal layer of the band pass filter provides two functions. The first function is as part of the ITF filter selecting the wavelength desired for the device. The second function is as a conductive layer allowing a bias to be provided between the substrate and the metal layer thereby producing a field within the surface of the substrate to which the filter is applied.

The disclosure discloses a method for detecting the depth of a vertical gate of a transfer transistor of a CMOS image sensor. The effective electrical thickness of planar gate polysilicon of a transfer transistor of a reference CMOS image sensor is obtained through a planar test, the capacitance of a vertical gate structure of a transfer transistor of a to-be-tested CMOS image sensor is obtained through a vertical test, and then the equivalent depth of the vertical gate of the transfer transistor of the to-be-tested CMOS image sensor is calculated accordingly. The depth of the gates of the transfer transistors of all CMOS image sensors can be monitored on line without damaging a silicon wafer, it is conducive to finding the abnormality of the depth of the gates of the transfer transistors in time, and the product quality of the CMOS image sensor can be effectively monitored.

An imaging device, including a monolithic semiconductor integrated circuit substrate, comprises a focal plane array of pixel cells. Each one of the pixel cells includes a gate overlying a region of the substrate operable to convert incident radiation into charge carriers. The pixel also includes a CMOS readout circuit including at least one output transistor in the substrate. The pixel further includes a charge coupled device section on the substrate adjacent the gate, the charge coupled device section including a sense node to receive charge carriers transferred from the region of the substrate beneath the gate. The sense node is coupled to the output transistor. The pixel also includes a reset switch coupled to the sense node. The pixel's charge coupled device section has a buried channel region. The pixel also includes one or more bias enabling switches operable to enable a bias voltage to be applied to the gate. At least one of the reset switch or the one or more bias enabling switches is formed in the buried channel region.

A pixel circuit, a method for performing a pixel-level background light subtraction, and an imaging device are disclosed. In one example of the present disclosure, the pixel circuit includes an overflow gate transistor, a photodiode, and two taps. Each tap of the two taps is configured to store a background signal that is integrated by the photodiode, subtract the background signal from a floating diffusion, store a combined signal that is integrated by the photodiode at the floating diffusion, and generate a demodulated signal based on a subtraction of the background signal from the floating diffusion and a storage of the combined signal that is integrated at the floating diffusion.

An image sensing device includes a substrate structured to include a first surface on a first side of the substrate and a second surface on a second side of the substrate opposite to the first side and to further include a first active region and a second active region in a portion of the substrate near the second surface, at least one photoelectric conversion element formed in the substrate, and structured to generate photocharges by performing photoelectric conversion of incident light received through the first surface of the substrate, a floating diffusion region formed near the second surface of the substrate, and structured to receive the photocharges from the photoelectric conversion element and temporarily store the received photocharges, a transistor formed in the first active region, and structured to include a first source/drain region coupled to the floating diffusion region, and a well pickup region formed in the second active region, and structured to apply a bias voltage to the substrate. The first source/drain region and the well pickup region have complementary conductivities and are formed to be in contact with each other.

A solid-state imaging apparatus includes: an overflow element group that accumulates a signal charge that overflows from a photodiode; and a floating diffusion layer that selectively holds a signal charge transferred from the photodiode and a signal charge transferred from the overflow element group. The overflow element group includes m groups (m≥2) connected in series in stages, each group including an overflow element and a storage capacitive element. An overflow element among the groups transfers, to the storage capacitive element included in the same group as the overflow element, a signal charge that overflows from the photodiode or a signal charge from an upstream storage capacitive element among the groups.

An image sensor is provided. The image sensor may include a substrate including first and second surfaces opposite to each other, a device isolation layer extending through the substrate and having a surface level with the second surface of the substrate, an active region comprising first and second pixel regions spaced apart and separated from each other by the device isolation layer, a photoelectric device located in the substrate and configured to convert light into electric charges, a microlens on the first surface, a first select transistor and a first source follower transistor in the first pixel region, a second source follower transistor in the second pixel region, a first node between the first select transistor and the first source follower transistor, on the first pixel region, and a second node on one side of the first select transistor on the first pixel region.

A solid-state imaging device includes a light receiving section formed by such exposure as to stitch a plurality of patterns in a first direction on a semiconductor substrate. The light receiving section includes a plurality of pixels disposed in a two-dimensional array in the first direction and a second direction perpendicular to the first direction. Electric charges are transferred in the second direction in each of pixel columns consisting of a plurality of pixels disposed in the second direction, among the plurality of pixels.