SiC Schottky rectifiers are described with a Silicon Carbide (SiC) layer, a metal contact, and an n-type channel region disposed between the SiC layer and the metal contact. A p-pillar may be formed adjacent to the metal contact and extending in a direction of the SiC layer, and a a p-type shielding body adjacent to the metal contact and extending from the metal contact in a direction of the SiC layer. The SiC Schottky rectifiers may include a first channel region of the n-type channel region having a first n-type doping concentration, and disposed between the p-pillar and the p-type shielding body, the first channel region being adjacent to the metal contact. The SiC Schottky rectifiers may include an n-pillar providing a second channel region of the n-type channel region and having a second n-type doping concentration that is lower than the first n-type doping concentration in the first channel region, the n-pillar being disposed adjacent to the first channel region, and to the p-pillar.

The present disclosure provides a method for manufacturing a high voltage semiconductor device which includes providing a semiconductor substrate; forming at least one first isolation structure and at least one second isolation structure in the semiconductor substrate; forming a gate structure on the semiconductor substrate and at a side of the at least one first isolation structure; and forming at least one first drift region in the semiconductor substrate at a side of the gate structure, in which a bottom of the at least one first isolation structure and a bottom of the at least one second isolation structure are deeper than a bottom of the first drift region.

A transient voltage suppression device includes a substrate; a first conductivity type well region disposed in the substrate and comprising a first well and a second well; a third well disposed on the substrate, a bottom part of the third well extending to the substrate; a fourth well disposed in the first well; a first doped region disposed in the second well; a second doped region disposed in the third well; a third doped region disposed in the fourth well; a fourth doped region disposed in the fourth well; a fifth doped region extending from inside of the fourth well to the outside of the fourth well, a portion located outside the fourth well being located in the first well; a sixth doped region disposed in the first well; a seventh doped region disposed below the fifth doped region and in the first well.

A TVS device and a manufacturing method therefor. The TVS device comprises: a first doping type semiconductor substrate (100); a second doping type deep well I (101), a second doping type deep well II (102), and a first doping type deep well (103) provided on the semiconductor substrate; a second doping type heavily doped region I (104) provided in the second doping type deep well I (101); a first doping type well region (105) and a first doping type heavily doped region I (106) provided in the second doping type deep well II (102); a first doping type heavily doped region II (107) and a second doping type heavily doped region II (108) provided in the first doping type deep well (105); a second doping type heavily doped region III (109) located in the first doping type well region (105) and the second doping type deep well II (102); and a first doping type doped region (110) provided in the first doping type well region (105).

The present disclosure provides a method for manufacturing a high voltage semiconductor device which includes providing a semiconductor substrate; forming at least one first isolation structure and at least one second isolation structure in the semiconductor substrate; forming a gate structure on the semiconductor substrate and at a side of the at least one first isolation structure; and forming at least one first drift region in the semiconductor substrate at a side of the gate structure, in which a bottom of the at least one first isolation structure and a bottom of the at least one second isolation structure are deeper than a bottom of the first drift region.

A semiconductor device includes a semiconductor substrate, a trench provided in the semiconductor substrate, a trench gate formed in the trench, a vertical transistor having the trench gate, an active region having the vertical transistor, a field region surrounding the active region and having a protection diode, and a field insulating film formed on a surface of the semiconductor substrate, the protection diode being formed on the field insulating film. The trench gate includes a first polysilicon layer and has an embedded part embedded in the trench and an extension part connected to the embedded part and extending onto the surface of the semiconductor substrate, the protection diode includes a second polysilicon layer thicker than the first polysilicon layer, and an overlapping part having the second polysilicon layer is formed on the extension part.

The HEMT includes a channel layer, a barrier layer, a drain, and a gate conductor. The barrier layer is disposed on the channel layer. The drain is disposed on the barrier layer. The gate conductor is disposed on the barrier layer. The channel layer includes a doped semiconductor structure overlapping with a top surface of the channel layer and having a bottom-most border that is located over a bottom-most surface of the channel layer and is spaced apart from the bottom-most surface of the channel layer. The doped semiconductor structure is located between the drain and the gate conductor.

The present disclosure relates to a Gallium Nitride (GaN) power transistor, comprising: a buffer layer; a barrier layer deposited on the buffer layer, wherein a gate region is formed on top of the barrier layer; a p-type doped GaN layer deposited on the barrier layer at the gate region; and a metal gate layer deposited on top of the p-type doped GaN layer, wherein the metal gate layer is contacting the p-type doped GaN layer to form a Schottky barrier, wherein a thickness of the p-type doped GaN layer, a metal type of the metal gate layer and a p-type doping concentration of the p-type doped GaN layer are based on a known relationship of a pGaN Schottky gate depletion region thickness with respect to a p-type doping concentration and a gate metal type.

According to various embodiments, there is provided a MOSFET device. The MOSFET device may include a substrate; a first doped region disposed in the substrate; a second doped region disposed in the substrate, wherein the first doped region and the second doped region are laterally adjacent to each other; a third doped region disposed in the first doped region; a fourth doped region disposed in the second doped region; a gate disposed on the substrate, over the first and second doped regions, and between the third and fourth doped regions; and at least one high resistance region embedded in at least the second doped region, wherein the first doped region has a first conductivity type, wherein the second doped region, the third doped region, and the fourth doped region have a second conductivity type, wherein the first conductivity type and the second conductivity type are different.

A circuit device includes an N-type well on a P-type substrate, a P-type well provided in the N-type well, a circuit element provided in the P-type well, a P-type well provided in an N-type well, and a circuit element provided in the P-type well. A ground power supply voltage is supplied to a P-type well. A power supply voltage different from the ground power supply voltage is supplied to a P-type well. The ground power supply voltage or a first potential that is greater than or equal to the potential of the ground power supply voltage and less than the potential of a high potential-side power supply voltage is supplied to an N-type well.