A light emitting device including a substrate having a substantially rectangular shape when viewed in plan view, light emitting elements arranged along a first long side of the substantially rectangular shape of the substrate, light transmissive members each disposed on an upper surface of each of the light emitting elements, and a cover member having a substantially rectangular shape when viewed in plan view. The cover member covering an upper surface of the substrate, and exposing upper surfaces of the light transmissive members. The device includes terminals exposed from the cover member. The terminals being arranged along a second long side of the substantially rectangular shape of the substrate, and being capable of individually driving the light emitting elements. When viewed in the plan view, a long side of the substantially rectangular shape of the cover member overlaps with at least one of the first and the second long sides.

An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.

The present disclosure relates to a semiconductor package with a lid that includes a lid conductive structure. The semiconductor package includes a substrate with a top surface, a lid over the top surface of the substrate, and at least one substrate-mounted component mounted on the top surface of the substrate. Herein, a cavity is defined within the lid and over the top surface of the substrate. The substrate includes a metal pad over the top surface of the substrate. The lid includes a lid conductive structure, a lid body, and a perimeter wall that extends from a perimeter of the lid body toward the top surface of the substrate. The lid conductive structure includes a body conductor that extends through a portion of the lid body and a wall conductor that is coupled to the body conductor, extends through the perimeter wall, and is electronically coupled to the metal pad.

Some embodiments relate to a semiconductor device. The semiconductor device includes a substrate. A first die is coupled beneath a lower surface of the substrate. A second die is coupled beneath the lower surface of the substrate and is disposed over the first die. A thermal contact pad is arranged beneath a lower surface of the second die and an upper surface of the first die. The thermal contact pad thermally isolates the first die from the second die.

Some embodiments relate to a semiconductor device. The semiconductor device includes a substrate and a first die coupled to a top surface of the substrate. A second die is coupled to a bottom surface of the substrate. A thermal contact pad couples the second die to the bottom surface of the substrate. The thermal contact pad electrically isolates the first die from the second die. A molding compound resides over the substrate and surrounds the first and second dies and the thermal contact pad.

A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

A semiconductor device, including a lower semiconductor die, one or more upper semiconductor dies disposed over the lower semiconductor die, a non-conductive fillet material disposed between adjacent semiconductor dies of the lower semiconductor die and the one or more upper semiconductor dies, the non-conductive fillet material having edge regions that squeeze out from space between adjacent semiconductor dies, a dielectric layer disposed on a backside of the lower semiconductor die and under the one or more upper semiconductor dies, a buffer layer disposed above the dielectric layer and in contact to at least one edge region of the non-conductive fillet material, and an encapsulant material disposed on sidewalls and top surface of the semiconductor device, the encapsulant material encapsulating the lower semiconductor die and the one or more upper semiconductor dies.

A semiconductor package includes a package substrate including a package substrate comprising a base layer and a connection pad disposed on an upper surface of the base layer; a semiconductor chip disposed on the package substrate and the semiconductor chip comprises a semiconductor substrate and a bonding pad disposed on an upper surface of the semiconductor substrate; a bonding wire in contact with the connection pad and the bonding pad; a first dam structure disposed on the package substrate and arranged between the connection pad and the bonding pad; a non-conductive filler disposed on the package substrate surrounding the first dam structure and the bonding wire; and a mold layer disposed on the package substrate covering a portion of an upper surface of the package substrate and surrounding the semiconductor chip and the non-conductive filler.

An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.

In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.