A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

A method for manufacturing a semiconductor apparatus, including preparing a first substrate provided with a pad optionally having a plug and a second substrate or device provided with a plug, forming a solder ball on at least one of the pad or plug of first substrate and the plug of second substrate or device, covering at least one of a pad-forming surface of first substrate and a plug-forming surface of second substrate or device with a photosensitive insulating layer, forming an opening on the pad or plug of the substrate or device that has been covered with photosensitive insulating layer by lithography, pressure-bonding the second substrate or device's plug to the pad or plug of first substrate with the solder ball through the opening, electrically connecting pad or plug of first substrate to second substrate or device's plug by baking, and curing photosensitive insulating layer by baking.

Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can enhance adhesiveness, moisture-resistant adhesion reliability, and cooling/heating cycle reliability. An inkjet adhesive according to the present invention comprises a photocurable compound, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the compound capable of reacting with the thermosetting compound contains aromatic amine.

A manufacturing method comprises preparing a bonding substrate having bumps thereon; preparing a mounted member having external conductive members; applying a fixing material to the surface of the bonding substrate and/or to a surface of the mounted member; and fixing the bonding substrate and the mounted member with the fixing material such that the bumps contact the external conductive members. The fixing material is prepared to contain a first compound and a second compound, each having respective viscosities which change depending on their respective temperature profiles; and applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing comprises pressing the bonding substrate against the mounted member when the fixing material has a temperature lower than the first temperature; and heating the fixing material to a temperature higher than the second temperature and curing the fixed material.

A display device and a method of manufacturing the same are provided. The display device includes a first electrode disposed on a substrate, an adhesive auxiliary layer disposed on the first electrode and including a self-assembled monolayer, a light emitting element disposed on the adhesive auxiliary layer, and a contact electrode disposed between the adhesive auxiliary layer and the light emitting element. The light emitting element includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer, and an intermediate layer disposed between the first semiconductor layer and the second semiconductor layer.

A display device and a method of manufacturing the same are provided. The display device includes a first electrode disposed on a substrate, an adhesive auxiliary layer disposed on the first electrode and including a self-assembled monolayer, a light emitting element disposed on the adhesive auxiliary layer, and a contact electrode disposed between the adhesive auxiliary layer and the light emitting element. The light emitting element includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer, and an intermediate layer disposed between the first semiconductor layer and the second semiconductor layer.

A wafer laminating method includes a cooling step of cooling a first wafer, a laminating step of producing a laminated wafer by stacking and laminating a second wafer on a surface of the first wafer when condensation forms on the surface of the cooled first wafer, and a heat treatment step of subjecting the laminated wafer to heat treatment.

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.