A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.

A dual-side cooling package includes a first semiconductor die and a second semiconductor die disposed between a first direct bonded metal (DBM) substrate and a second DBM substrate. A metal surface of the first DBM substrate defines a first outer surface of a package and a metal surface of the second DBM substrate defines a second outer surface of the package. The first semiconductor die is thermally coupled to the first DBM substrate. A first conductive spacer thermally couples the first semiconductor die to the second DBM substrate. The second semiconductor die is thermally coupled to a second conductive spacer. Further, one of the second semiconductor die and the second conductive spacer is thermally coupled to the first DMB substrate and the other of the second semiconductor die and the second conductive spacer is thermally coupled to the second DBM substrate.

A semiconductor device includes a first semiconductor chip having a first surface and a second surface; a first adhesive layer on the first surface; a second semiconductor chip that includes a third surface and a fourth surface, and a connection bump on the third surface. The connection bump is coupled to the first adhesive layer. The semiconductor device includes a wiring substrate connected to the connection bump. The semiconductor device includes a first resin layer covering the connection bump between the second semiconductor chip and the wiring substrate, and covers one side surface of the second semiconductor chip connecting the third surface and the fourth surface. The first adhesive layer covers an upper portion of the at least one side surface. The first resin layer covers a lower portion of the at least one side surface. The first adhesive layer and the first resin layer contact each other.

Apparatuses and techniques include a substrate, a controller die mounted on the substrate, fingers electrically connecting the controller die to the substrate, a spacer mounted on the substrate adjacent to the controller die, and a first memory die mounted on the spacer. The first memory die is attached to a top surface of the spacer. The spacer has a curved edge facing the controller. The curved edge may have a first curve including a first curve apex extending away from the controller, a first curve peak on one side of the first curve apex, and a second curve peak on an opposite side of the first curve apex than the first curve peak. Additional fingers connect the controller and the first memory die at a point that is aligned with the space between the first curve and a line extending from the first curve peak and the second curve peak.

A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.

A light-emitting device includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from that of the first light-emitting element, a light-guide member covering a light extracting surface and lateral surfaces of the first light-emitting element and a light extracting surface and lateral surfaces of the second light-emitting element, and a wavelength conversion layer continuously covering the light extracting surface of each of the first and second light-emitting elements and disposed apart from each of the first and second light-emitting elements, and a first reflective member covering outer lateral surfaces of the light-guide member. An angle defined by an active layer of the first light-emitting element and an active layer of the second light-emitting element is less than 180° at a wavelength conversion layer side.

Apparatuses and techniques include a substrate, a controller die mounted on the substrate, fingers electrically connecting the controller die to the substrate, a spacer mounted on the substrate adjacent to the controller die, and a first memory die mounted on the spacer. The first memory die is attached to a top surface of the spacer. The spacer has a curved edge facing the controller. The curved edge may have a first curve including a first curve apex extending away from the controller, a first curve peak on one side of the first curve apex, and a second curve peak on an opposite side of the first curve apex than the first curve peak. Additional fingers connect the controller and the first memory die at a point that is aligned with the space between the first curve and a line extending from the first curve peak and the second curve peak.

A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.

A display device is disclosed. The display device includes a substrate having a plurality of pixels, wherein each of the plurality of pixels includes at least one light emitting chip, and a structure on one side of at least one of the plurality of pixels. A base material of the light emitting chip is the same as a base material of the structure.

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.