Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer.

According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.

According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.

A power field-effect transistor package is fabricated. A leadframe including a flat plate and a coplanar flat strip spaced from the plate is provided. The plate has a first thickness and the strip has a second thickness smaller than the first thickness. A field-effect power transistor chip having a third thickness is provided. A first and second contact pad on one chip side and a third contact pad on the opposite chip side are created. The first pad is attached to the plate and the second pad to the strip. Terminals are concurrently attached to the plate and the strip so that the terminals are coplanar with the third contact pad. The thickness difference between plate and strip and spaces between chip and terminals is filled with an encapsulation compound having a surface coplanar with the plate and the opposite surface coplanar with the third pad and terminals. The chip, leadframe and terminals are integrated into a package having a thickness equal to the sum of the first and third thicknesses.

A baseplate for a semiconductor module comprises at least one elevation. The at least one elevation is formed integrally with the baseplate. The baseplate has a uniform first thickness or a thickness which decreases continuously from the edge regions toward the center and which is increased locally up to a maximum second thickness in the region of each of the at least one elevation.

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.

Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.