An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.

An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.

A terminal connection portion, which includes an IC including a plurality of input bumps and a plurality of output bumps, and a terminal connection portion including a plurality of input terminal electrodes and a plurality of output terminal electrodes, is provided in a frame region, and in the terminal connection portion, an electrode insulating film is provided on the input terminal electrodes and the output terminal electrodes. A protruding portion is provided on the electrode insulating film, and the protruding portion overlaps with the IC in a plan view, and overlaps with the input bumps and the output bumps when viewed from a direction parallel to a substrate surface of a resin substrate layer.

The present disclosure provides a display panel and a display device. The display panel includes: a display substrate, an IC chip, and a circuit board. The display substrate includes a first bonding portion including a first detection pin and a second detection pin, a second bonding portion connected to the first bonding portion and including a first connection pin and second connection pin which are connected by a connection wire included by the circuit board, a first connection line connecting the first detection pin to the first connection pin and including a first crack detection line, and a second connection line connecting the first detection pin to the second connection pin. The IC chip is bonded to the first bonding portion and configured to determine cracks on an edge of the display substrate according to electric signals of the first detection pin and the second detection pin.

The present disclosure provides a display panel and a display device. The display panel includes: a display substrate, an IC chip, and a circuit board. The display substrate includes a first bonding portion including a first detection pin and a second detection pin, a second bonding portion connected to the first bonding portion and including a first connection pin and second connection pin which are connected by a connection wire included by the circuit board, a first connection line connecting the first detection pin to the first connection pin and including a first crack detection line, and a second connection line connecting the first detection pin to the second connection pin. The IC chip is bonded to the first bonding portion and configured to determine cracks on an edge of the display substrate according to electric signals of the first detection pin and the second detection pin.

A multichip package and a method for manufacturing the same are provided. A multichip package includes: a plurality of semiconductor chips each mounted on corresponding lead frame pads; lead frames connected to the semiconductor chips by a bonding wire; and fixed frames integrally formed with at least one of the lead frame pads and configured to support the lead frame pads on a package-forming substrate.

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.