A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

A light emitting element, a light emitting device and a manufacturing method thereof are provided. The manufacturing method of the light emitting device includes forming a first electrode and a second electrode spaced apart from each other on a substrate on which the light emitting area is defined; injecting a solution including a light emitting element and a liquid crystal molecule into the light emitting area; and aligning the light emitting element such that the first electrode and the second electrode are electrically coupled; wherein the light emitting element includes a first semiconductor layer; a second semiconductor layer; an active layer interposed between the first semiconductor layer and the second semiconductor layer; an insulation layer formed to surround an outer surface of the active layer; and an organic ligand layer formed on an outer surface of the insulating layer.

Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.

A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED includes an active layer including a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.

A method of manufacturing display device is disclosed. a substrate includes a basal layer and metal contacts on the top surface. An insulation layer is disposed on the top surface and includes a first mounting surface and a bottom surface. Multiple grooves are formed on the insulation layer and each extends from the first mounting surface to the bottom surface. The grooves respectively correspond to the metal contacts and expose respective metal contacts. An electromagnetic force is provided with a direction from the basal layer toward the insulation layer. A droplet containing multiple micro components is provided on the first mounting surface. A configuration of an electrode of the micro component corresponds to a configuration of one of the grooves. The electrode is attracted to the corresponding groove by the electromagnetic force so as to electrically contact the metal contact.

A display device includes: a pixel circuit layer including a plurality of transistors; first partition wall and a second partition wall on the pixel circuit layer, each of the first and second partition walls having a shape protruding in a thickness direction; a first electrode and a second electrode on the same layer and respectively on the first partition wall and the second partition wall; a light emitting element between the first electrode and the second electrode; and a semiconductor pattern directly on the first electrode.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. A patterned hydrophobic layer defines the locations of the printed dots of the devices. The devices in each group are connected in parallel so that each group acts as a single device. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.

A programmable circuit includes an array of printed groups of microscopic transistors or diodes having pn junctions. The devices are pre-formed and printed as an ink and cured. The devices have a proper orientation and a reverse orientation after settling on a conductor layer. The devices are connected in parallel within small groups. To neutralize the reverse-oriented devices, a sufficient voltage is applied across the parallel-connected diodes to forward bias only the devices having the reverse orientation. This causes a sufficient current to flow through each of the reverse-orientated devices to destroy an electrical interface between an electrode of the devices and the conductor layer to create an open circuit, such that those devices do not affect a rectifying function of the devices in the group having the proper orientation. An interconnection conductor pattern may then interconnect the groups to form complex logic circuits.