Patent classifications
H10N60/0632
Superconductor Article with Directional Flux Pinning
A method and composition for doped HTS tapes having directional flux pinning and critical current.
SUPERCONDUCTOR FLUX PINNING WITHOUT COLUMNAR DEFECTS
There is a superconducting article that includes a superconducting film comprising a substrate, one or more buffer layers, and a high temperature superconducting (HTS) layer. The superconducting layer may be comprised of the chemical composition REBa.sub.2Cu.sub.3O.sub.7−x, where RE is one or more rare earth elements, for example: Y, La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. The superconductor layer is produced using Photo-Assisted Metal Organic Chemical Vapor Deposition (PAMOCVD) and contains non-superconducting nanoparticles. The nanoparticles are substantially provided in the a-b plane and naturally oriented. The non-superconducting nanoparticles provide flux pinning centers that improve the critical current properties of the superconducting film.
Josephson Junction using molecular beam epitaxy
According to various implementations of the invention, a vertical Josephson Junction device may be realized using molecular beam epitaxy (MBE) growth of YBCO and PBCO epitaxial layers in an a-axis crystal orientation. Various implementations of the invention provide improved vertical JJ devices using SiC or LSGO substrates; GaN, AlN, or MgO buffer layers; YBCO or LSGO template layers; YBCO conductive layers and various combinations of barrier layers that include PBCO, NBCO, and DBCO. Such JJ devices are simple to fabricate with wet and dry etching, and allow for superior current flow across the barrier layers.
FILM STRUCTURE, PIEZOELECTRIC FILM AND SUPERCONDUCTOR FILM
According to the present invention, a piezoelectric film having a single crystal structure is able to be formed, from various piezoelectric materials, on a film structure of the present invention. A film structure according to the present invention includes: a substrate; a buffer film which is formed on the substrate and has a tetragonal crystal structure containing zirconia; a metal film containing a platinum group element, which is formed on the buffer film by means of epitaxial growth; and a film containing Sr(Ti.sub.1−x, Ru.sub.x)O.sub.3 (wherein 0≤x≤1), which is formed on the metal film by means of epitaxial growth.
Method for manufacture of nanostructure electrical devices
The present disclosure further relates to nanostructures, in particular hybrid nanostructures with patterned growth of various layers for use in nanoscale electronic devices, such as hybrid semiconductor nanostructures with patterned growth and/or deposition of superconducting material for use in quantum devices. The presently disclosed method can be utilized for in-situ manufacturing of nanoscale electronic devices that have not been contaminated by ex-situ processes. One embodiment relates to a method for manufacturing a substrate for growth of crystalline nanostructures, the method comprising the steps of: depositing one or more layers of a crystal growth compatible dielectric material, such as silicon oxide, in a predefined pattern on the surface of a crystal growth compatible substrate to create a predefined etch pattern of said crystal growth compatible material, and selectively etching the substrate surface around said etch pattern to provide at least one under-etched platform which is vertically raised from the etched substrate surface.
SUPERCONDUCTING WIRE AND METHOD OF FORMING THE SAME
Provided is a superconducting wire. The superconducting wire comprises a substrate, a superconducting film on the substrate and a pinning center in the superconducting film. The superconducting film includes Y.sub.1-xRE.sub.xBCO and the pinning center has an additive of Ba.sub.2YNbO.sub.6.
(RE,Y)-123 SUPERCONDUCTING FILM CONTAINING MIXED ARTIFICIAL PINNING CENTERS AND PREPARATION METHOD THEREOF
The invention relates to a (RE,Y)-123 superconducting film containing mixed artificial pinning centers and a preparation method thereof, wherein a stoichiometric ratio of Cu in a parent phase of the (RE,Y)-123 superconducting film is 3.05-5; the mixed artificial pinning centers include a perovskite structure BaMO3 and a double-perovskite structure oxide Ba2(RE,Y)NO6; and a total mole percentage of Ba2(RE,Y)NO6 in the superconducting film is not less than 2.5%. The mixed artificial pinning centers form well-aligned column structures along the thickness direction in the superconducting film. The invention is intended not only to solve the problem that a single secondary phase cannot be well aligned along the thickness direction of (RE,Y)-123 when using the high-speed pulsed laser deposition technique, but also to effectively overcome the film thickness effect of the (RE,Y)-123 superconducting film containing mixed artificial pinning centers, hence the in-field current carrying capacity of the superconducting film is significantly improved in industrialized high-speed production.
Ultra-thin film superconducting tapes
An ultra-thin film superconducting tape and method for fabricating same is disclosed. Embodiments are directed to a superconducting tape being fabricated by processes which include removing a portion of the superconducting tape's substrate subsequent the substrate's initial formation, whereby a thickness of the superconducting tape is reduced to 15-80 μm.
Oxide superconducting thin film material, oxide superconducting thin film wire, and method for manufacturing oxide superconducting thin film
An oxide superconducting thin film material includes: a metal substrate having a surface with a biaxially oriented crystal orientation structure; an intermediate layer biaxially oriented and formed on the metal substrate; and an oxide superconducting thin film formed on the intermediate layer and composed of a RE123-based oxide superconductor represented by REBa.sub.2Cu.sub.3O.sub.y. The oxide superconducting thin film includes Br (bromine).
HIGHLY-TEXTURED THIN FILMS
A superconductor tape and method for fabricating same are disclosed. Embodiments are directed to a superconductor tape including a substrate and a buffer stack. In one embodiment, the buffer stack includes: an Ion Beam-Assisted Deposition (IBAD) template layer above the substrate; a homo-epitaxial film of MgO or TiN above the IBAD template layer; an epitaxial film of silver above the homo-epitaxial film; and a homo-epitaxial film of LaMnO3 (LMO) above the silver epitaxial film. The superconductor tape also includes a superconductor film above the buffer stack. These and other embodiments achieve a LMO film with substantially improved texture, resulting in a superconductor structure having high critical current and significantly reduced power consumption and cost.