A substrate processing apparatus includes a liquid processing unit configured to supply, onto a front surface of a substrate, individual multiple processing liquids different from each other; an exhaust unit configured to exhaust an exhaust gas exhausted from the liquid processing unit to an outside. The exhaust unit includes a main exhaust pipe including a first portion and a second portion, a first individual exhaust pipe, a second individual exhaust pipe, a switching unit and an outside air introduction pipe. The switching unit includes a first switching mechanism, a second switching mechanism, a third switching mechanism provided between the first portion and the second portion of the main exhaust pipe, an outside air introduction pipe connected to the second portion to allow outside air to be introduced into the second portion, and a fourth switching mechanism provided in the outside air introduction pipe.

The inventive concept relates to a heating member for heating a substrate. In an embodiment, the heating member includes a heater plate having at least one heating element bonded thereto, a connecting plate having a first space formed therein in which the heating element is accommodated, and a control plate having a control element bonded thereto, the control element being electrically connected with the heating element to control the heating element.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber configured to treat a substrate; a transfer assembly configured to transfer the substrate to the process chamber; and a diagnosis unit configured to detect an abnormal state of the transfer assembly, and wherein the transfer assembly comprises: a housing having a transfer space; and a transfer robot configured to transfer the substrate to the process chamber, and wherein the diagnosis unit comprises: a detection member for detecting an air vibration generated within the housing; and a diagnosis member for diagnosing a driving unit of the transfer assembly based on the air vibration detected by the detection member.

A substrate processing system includes a hinge assembly configured to allow a substrate support and an RF bias assembly to slide, from a docked position to an undocked position, relative to other components of a processing chamber. A make-break connector is configured to supply fluid to at least one of the substrate support and the RF bias assembly. The make-break connector includes a first portion including a first fluid passage connected to a first conduit. A second portion includes a second fluid passage connected to a second conduit. The first fluid passage in the first portion fluidly communicates with the second fluid passage in the second portion. The first portion is configured to slide with the substrate support and the RF bias assembly relative to the second portion and the other portions of the processing chamber. The first portion is located inwardly relative to the second portion.

A hand for holding the substrate includes a hand main body and a plurality of seating members mounted on the hand main body and on which the substrate is to be seated. Each of the plurality of seating member includes a shaft member supported to the hand main body and a lever member that is supported to the shaft member and includes a first end portion including a seating portion on which the substrate is to be seated and a second end portion disposed on a side opposite to the first end portion across the shaft member. At least a part of the plurality of seating members further includes a biasing member for giving a force of rotating the lever member to the lever member such that the second end portion moves downward and a seating sensor configured to detect an upward movement of the second end portion.

The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

Provided in the present invention is a coating and development equipment, comprising a cassette module, a first process module, a second process module, and an interface module. A first inter-layer process manipulator, an intra-layer process manipulator group and a second inter-layer process manipulator are arranged between the first process module and the second process module, and the first inter-layer process manipulator, the second inter-layer process manipulator, and manipulators in the intra-layer process manipulator group each have two groups of end effectors facing oppositely, the number of each group of end effectors is m, and m is a natural number greater than or equal to 2, whereby the handling of a plurality of wafers can be realized and the production efficiency can be improved.

A heating/cooling device includes: a chamber; a plurality of substrate holders provided inside the chamber to support substrates; a plurality of LED light sources provided outside the chamber to irradiate the substrates held on the substrate holders with LED light having a wavelength that heats the substrates; a plurality of transmission windows provided between the plurality of substrate holders and the plurality of LED light sources to transmit the LED light radiated from the LED light sources; and a plurality of gas distribution parts provided inside the chamber to distribute and supply a cooling gas to the substrates held on the substrate holders.

A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.