Dry development or dry removal of metal-containing extreme ultraviolet radiation (EUV) photoresist is performed in atmospheric conditions or performed in process tools without vacuum equipment. Dry removal of the metal-containing EUV photoresist may be performed under atmospheric pressure or over-atmospheric pressure. Dry removal of the metal-containing EUV photoresist may be performed with exposure to an air environment or with non-oxidizing gases. A process chamber or module may be modified or integrated to perform dry removal of the metal-containing EUV photoresist with baking, wafer cleaning, wafer treatment, or other photoresist processing function. In some embodiments, the process chamber for dry removal of the metal-containing EUV photoresist includes a heating assembly for localized heating of a semiconductor substrate and a movable discharge nozzle for localized gas delivery above the semiconductor substrate.

A slide and pivot assembly for a process module bias assembly of a substrate processing system includes a slide torsion plate, one or more rails and bearings, a bias mounting plate, and a hinge assembly. The one or more rails and bearings are attached to the slide torsion plate or a processing chamber. The bias mounting plate is configured to hold a portion of a process module for processing a substrate. The hinge assembly is attached to the slide torsion plate and the bias mounting plate. The slide torsion plate, the bias mounting plate and the hinge assembly are configured to slide via the one or more rails and bearings in a lateral direction relative to the processing chamber. The bias mounting plate is configured to pivot relative to the slide torsion plate while the slide and pivot assembly is in at least a partially pulled out state.

A substrate processing apparatus includes: a group of modules including a plurality of processing modules that process a substrate and a plurality of relay modules on which the substrates are disposed to be transferred among the plurality of processing modules; a plurality of transfer mechanisms that transfer the substrates in an assigned section of a transfer path; a shared transfer mechanism shared for transfer in a first section and a second section separated from each other in the transfer path of the substrate; and a determination unit that determines a transfer destination of the substrates by the shared transfer mechanism between the first relay module and the second relay module based on a transfer status of the substrate in each section.

Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIO.sub.3 solution accommodated in a DIO.sub.3 bath; after the one or more substrates are processed in the DIO.sub.3 bath, taking the one or more substrates out from the DIO.sub.3 bath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIO.sub.3 and SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

A linear electrical machine including a frame with a level reference plane, an array of electromagnets connected to the frame and coupled to an alternating current power source energizing each electromagnet, at least one reaction platen of paramagnetic, diamagnetic, or non-magnetic conductive material disposed to cooperate with the electromagnets of the array of electromagnets so that excitation of the electromagnets with alternating current generates levitation and propulsion forces against the reaction platen that controllably levitate and propel the reaction platen along at least one drive line, in a controlled attitude relative to the drive plane, and a controller operably coupled to the array of electromagnets and the alternating current power source and configured so as to sequentially excite the electromagnets with multiphase alternating current with a predetermined excitation characteristic so that each reaction platen is levitated and propelled with up to six degrees of freedom.

An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.

A planarization apparatus includes a plurality of processors each configured to perform a planarization process on a substrate. Each of the processors includes a substrate chuck, and is configured to perform a planarization process on a substrate chucked by the substrate chuck. A conveyer is configured to convey a substrate chuck of a processor selected from the plurality of processors along a conveyance path including a common conveyance path shared by the plurality of processors. A supplier is arranged on a path of movement of the substrate chuck by the conveyer along the common conveyance path, and is configured to supply a composition to be used in the planarization process onto the substrate chucked by the substrate chuck.

A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.

A wafer conveying device, a chemical-mechanical planarization device and a wafer conveying method; the wafer conveying device comprises a manipulator used to clamp and transport wafers, as well as a transfer platform used to place the wafers; the manipulator consists of a 1.sup.st claw, a 2.sup.nd claw, a lifting platform, a movement mechanism, a rotation mechanism and a control mechanism; the transfer platform consists of a 1.sup.st transfer platform, a 2.sup.nd transfer platform and an installation rack. During wafer transmission, dry-wet wafers separation can be realized to avoid contamination to the clean wafers caused by liquids such as polishing liquid carried by the polished wafers, and to improve yield rate of the wafers.

Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.