A semiconductor device includes a region of semiconductor material of a first conductivity type. A body region of a second conductivity type is in the region of semiconductor material. The body region includes a first segment with a first peak dopant concentration, and a second segment laterally adjacent to the first segment with a second peak dopant concentration. A source region of the first conductivity type is in the first segment but not in at least part of the second segment. An insulated gate electrode adjoins the first segment and is configured to provide a first channel region in the first segment, adjoins the second segment and is configured to provide a second channel region in the second segment, and adjoins the source region. During a linear mode of operation, current flows first in the second segment but not in the first segment to reduce the likelihood of thermal runaway.

Provided is a semiconductor device including: a drift region of first conductivity type provided in a semiconductor substrate; a base region of second conductivity type provided in the semiconductor substrate; an emitter region of first conductivity type provided at a front surface of the semiconductor substrate; a contact region of second conductivity type provided on the base region and having a higher doping concentration than the base region; a contact trench portion provided at the front surface of the semiconductor substrate; a first barrier layer provided at a side wall and a bottom surface of the contact trench portion; and a second barrier layer provided in contact with the contact region at the side wall of the contact trench portion.

Methods and semiconductor devices are provided. A vertical junction field effect transistor (JFET) includes a substrate, an active region having a plurality of semiconductor fins, a source metal layer on an upper surface of the fins, a source metal pad layer coupled to the semiconductor fins through the source metal layer, a gate region surrounding the semiconductor fins, and a body diode surrounding the gate region.

A semiconductor device includes a semiconductor substrate, a transistor section, a diode section, and a boundary section provided between the transistor section and the diode section in the semiconductor substrate. The transistor section has gate trench portions which are provided from an upper surface of the semiconductor substrate to a position deeper than that of an emitter region, and to each of which a gate potential is applied. An upper-surface-side lifetime reduction region is provided on the upper surface side of the semiconductor substrate in the diode section and a partial region of the boundary section, and is not provided in a region that is overlapped with the gate trench portion in the transistor section in a surface parallel to the upper surface of the semiconductor substrate.

A device includes a diode that includes a first group III-nitride (III-N) material and a transistor adjacent to the diode, where the transistor includes the first III-N material. The diode includes a second III-N material, a third III-N material between the first III-N material and the second III-N material, a first terminal including a metal in contact with the third III-N material, a second terminal coupled to the first terminal through the first group III-N material. The device further includes a transistor structure, adjacent to the diode structure. The transistor structure includes the first, second, and third III-N materials, a source and drain, a gate electrode and a gate dielectric between the gate electrode and each of the first, second and third III-N materials.

In a semiconductor device according to the technology disclosed in the present specification, a temperature detection region is provided with a diffusion layer of a second conductivity type provided on a surface layer of a drift layer of a first conductivity type, a well layer of a first conductivity type provided on a surface layer of the diffusion layer and electrically connected to an anode electrode, and a cathode layer of a first conductivity type provided on a surface layer of the well layer and electrically connected to a cathode electrode.

Provided are an inverter including a first source and drain, an interlayer insulating film on the first source, a second source on the interlayer insulating film, a second drain on the first drain, a first channel between the first source and drain, a second channel over the first channel between the second source and drain, a gate insulating film covering outer surfaces of the first and second channel, a part of a surface of the first source in the direction to the first drain, a part of a surface of the second source in the direction to the second drain, a part of a surface of the first drain in the direction to the first source, and a part of a surface of the second drain in the direction to the second source, and a gate electrode between the first source and drain and between the second source and drain.

A semiconductor device includes a semiconductor substrate, a contact region, a carrier suppression region and an electrode. The semiconductor substrate is shared by an insulated gate bipolar transistor (IGBT) region with an IGBT element and a freewheeling diode (FWD) region with an FWD element. The carrier suppression region is exposed from a surface of the semiconductor substrate in the IGBT region, and has a lower impurity concentration than the contact region. The carrier suppression region has a Schottky barrier junction with the electrode.

In a RC-IGBT chip, an anode electrode film and an emitter electrode film are arranged with a distance therebetween. The anode electrode film and the emitter electrode film are electrically connected by a wiring conductor having an external impedance and an external impedance. The external impedance and the external impedance include the resistance of the wiring conductor and the inductance of the wiring conductor.

A switching circuit forming a bidirectional switch between a first node and a second node and resting on a substrate, the circuit comprising°: a first branch with a first diode in series with a first heterojunction field-effect transistor, a second branch with a second heterojunction field-effect transistor in series with a second diode, the first branch and the second branch being mounted in parallel to one another and so that the first diode and the second diode are arranged in antiparallel or in anti-series with respect to one another, the first transistor, the second transistor being each provided with a control gate facing a heterojunction band forming an active zone in which an electron gas is capable of being formed, the first diode being a Schottky diode with a metal electrode in contact with the heterojunction band, the second diode being a Schottky diode with a metal electrode in contact with the heterojunction band, the first diode, the first transistor, the second diode, the second transistor sharing the same active zone (FIG. 5).