Circuits, systems, devices, and methods related to transistors with Schottky barriers are discussed herein. For example, a method of fabricating a transistor can include forming a p-well or an n-well in a substrate and forming a gate for the transistor. The method can also include doping a region within the p-well or n-well with a concentration below a threshold and forming a conductor layer on the doped region.

There is provided a method of manufacturing a transistor, the method comprising: (a) providing a substrate having a semiconductor surface; (b) providing a graphene layer structure on a first portion of the semiconductor surface, wherein the graphene layer structure has a thickness of n graphene monolayers, wherein n is at least 2; (c) etching a first portion of the graphene layer structure to reduce the thickness of the graphene layer structure in said first portion to from n?1 to 1 graphene monolayers; (d) forming a layer of dielectric material on the first portion of the graphene layer structure; and (e) providing: a source contact on a second portion of the graphene layer structure; a gate contact on the layer of dielectric material; and a drain contact on a second portion of the semiconductor surface of the substrate.

Semiconductor devices include a semiconductor layer comprising a channel region and source/drain regions. A gate stack is formed on the channel region. A dielectric layer is formed on the semiconductor layer in the source/drain regions. Source/drain structures are formed over the dielectric layer in the source/drain regions.

A flash memory device and its manufacturing method are presented. The flash memory device includes a substrate; a memory unit on the substrate, comprising a channel structure, wherein the channel structure comprises, sequentially from inner to outer of the channel structure, a channel layer comprising a first component substantially perpendicular to an upper surface of the substrate and a second component on the first component, a tunnel insulation layer wrapped around the channel layer, a charge capture layer wrapped around the tunnel insulation layer, and a blocking layer wrapped around the charge capture layer; a plurality of gate structures wrapped around the channel structure and arranged along a symmetry axis of the channel structure with a topmost gate structure wrapped around the second component; and a channel contact component connecting to, and forming a Schottky contact with, the second component of the channel layer. This device reduces the leakage current.

A method for providing a semiconductor device and the device so formed are described. A doped semiconductor layer is deposited on a semiconductor underlayer. At least a portion of the semiconductor underlayer is exposed. A dopant for the doped semiconductor layer is selected from a p-type dopant and an n-type dopant. An ultraviolet-assisted low temperature (UVLT) anneal of the doped semiconductor layer is performed in an ambient. The ambient is selected from an oxidizing ambient and a nitriding ambient. The oxidizing ambient is used for the n-type dopant. The nitriding ambient is used for the p-type dopant. A sacrificial layer is formed by the doped semiconductor layer during the UVLT anneal. The dopant is driven into the portion of the semiconductor underlayer from the doped semiconductor layer by the UVLT anneal, thereby forming a doped semiconductor underlayer. The sacrificial layer is then removed.

A nanowire transistor includes undoped source and drain regions electrically coupled with a channel region. A source stack that is electrically isolated from a gate conductor includes an interfacial layer and a source conductor, and is coaxially wrapped completely around the source region, extending along at least a portion of the source region. A Schottky barrier between the source conductor and the source region is a negative Schottky barrier and a concentration of free charge carriers is induced in the semiconductor source region.

A semiconductor device includes a substrate comprising a heterostructure configured to support formation of a channel during operation, first and second dielectric layers supported by the substrate, the second dielectric layer being disposed between the first dielectric layer and the substrate, a gate supported by the substrate, disposed in a first opening in the first dielectric layer, and to which a bias voltage is applied during operation to control current flow through the channel, the second dielectric layer being disposed between the gate and the substrate, and an electrode supported by the substrate, disposed in a second opening in the first and second dielectric layers, and configured to establish a Schottky junction with the substrate.

The present disclosure provides a multi-functional electronic device with a black phosphorous-based single channel, wherein the device comprises: a black phosphorous-based single channel layer including a horizontal arrangement of a first semiconductor region and a second semiconductor region to define a horizontal junction therebetween, wherein the second semiconductor region has a lower hole-carrier density than the first semiconductor region; a first electrode connected to the first semiconductor region; a second electrode spaced from the first electrode and connected to the second semiconductor region; an ionic gel layer disposed on the first semiconductor region; and a gate electrode for receiving a gate voltage to generate an electric field in the channel layer.

Disclosed is a graphene-based ternary barristor using a Schottky junction graphene semiconductor. A graphene channel layer is doped with N-type and N-type dopants to have two different Fermi levels and form a PN junction. Accordingly, a voltage is applied to a gate electrode layer to move the Fermi levels of the graphene channel layer and adjust the height of the Schottky barrier, thus generating current. Also, the height of the Schottky barrier is adjusted depending on the doping concentration of the graphene channel That is, the height of the Schottky barrier is changed depending on the applied gate voltage, and thus the flow of current is changed. Also, it is possible to adjust the height of the Schottky barrier by adjusting the doping concentration of the graphene channel. Accordingly, since the graphene-based ternary barristor has a high current ratio by adjusting a gate voltage, the graphene-based ternary barristor may be applied to a logic circuit.

A semiconductor device includes a first potential supply line for supplying a first potential, a second potential supply line for supplying a second potential lower than the first potential, a functional circuit, and at least one of a first switch disposed between the first potential supply line and the functional circuit and a second switch disposed between the second potential supply line and the functional circuit. The first switch and the second switch are negative capacitance FET.