A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

A semiconductor device includes a solder supporting material above a substrate. The semiconductor device also includes a solder on the solder supporting material. The semiconductor device further includes selective laser annealed or laser ablated portions of the solder and underlying solder supporting material to form a semiconductor device having 3D features.

A semiconductor device includes a solder supporting material above a substrate. The semiconductor device also includes a solder on the solder supporting material. The semiconductor device further includes selective laser annealed or laser ablated portions of the solder and underlying solder supporting material to form a semiconductor device having 3D features.

A thermal interface material and systems and methods for forming a thermal interface material include depositing a layer of a composite material, including at least a first material and a second material, the first material including a carrier fluid and the second material including a filler particle suspended within the first material. A particle manipulator is positioned over the layer of the composite material, the particle manipulator including at least one emitter to apply a particle manipulating field to bias a movement of the filler particles. The second material is redistributed by applying the particle manipulating field to interact with the second material causing the second material to migrate from a surrounding region in the composite material into a high concentration region in the composite material to form a customized thermal interface such that the high concentration region is configured and positioned corresponding to a hotspot.

A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.

An electronic assembly having a power semiconductor component and a circuit carrier. The power semiconductor component has a contact region on opposite sides; the contact region facing the circuit carrier is in electrical contact with a connection region of the circuit carrier; the power semiconductor component is in electrical contact on the side facing away from the circuit carrier, in the region of the contact region, with a further circuit carrier; an additively generated connecting layer is arranged on the contact region and/or the connection region of the circuit carriers; and the connecting layer is connected to the connection region and/or the contact region using a solder connection. The connecting layer has a lower modulus of elasticity in a direction or plane extending perpendicularly to the surface of the power semiconductor component than in a direction or plane extending in parallel with the surface of the power semiconductor component.

A display apparatus includes a display panel including a lower base substrate and a connecting portion disposed on the lower base substrate, a flexible circuit board attached on a side surface of the display panel, and including a base film and a conductive pattern disposed on the base film, a conductive paste part disposed between the side surface of the display panel and the flexible circuit board, a first anisotropic conductive film (ACF) film disposed between the side surface of the display panel and the conductive paste part, and a second ACF film disposed between the conductive paste part and the flexible circuit board. The connecting portion is exposed at the side surface of the display panel, and the first ACF film directly makes contact with the connecting portion.