A semiconductor device includes: a wiring board, a chip stack provided above the wiring board and including a first semiconductor chip; a second semiconductor chip provided between the wiring board and the first semiconductor chip; a first adhesive layer provided between the first semiconductor chip and the second semiconductor chip and on the second semiconductor chip; and a sealing insulation layer including a first part and a second part, the first part covering the chip stack, and the second part extending between the wiring board and the first semiconductor chip.

A display device is disclosed. The display device includes a substrate having a plurality of pixels, wherein each of the plurality of pixels includes at least one light emitting chip, and a structure on one side of at least one of the plurality of pixels. A base material of the light emitting chip is the same as a base material of the structure.

A semiconductor device includes an insulating substrate formed by integrating a ceramic base plate and a cooling fin; a multiple of plate interconnection members; and a plurality of semiconductor elements. The one faces of the semiconductor elements are bonded to the ceramic base plate of the insulating substrate with a chip-bottom solder, and the other faces thereof are bonded to the plate-interconnection members with a chip-top solder so that plate interconnection members correspond respectively to the semiconductor elements. The chip-bottom solder and the chip-top solder both contain mainly Sn and 0.3-3 wt. % Ag and 0.5-1 wt. % Cu. This allows the semiconductor device to be reduced in size without impairing heat dissipation.

A first alignment resin (4) is formed in an annular shape on an electrode (3) of an insulating substrate (1). First plate solder (5) having a thickness thinner than that of the first alignment resin (4) is arranged on the electrode (3) on an inner side of the annular shape of the first alignment resin (4). A semiconductor chip (6) is arranged on the first plate solder (5). The first plate solder (5) is made to melt to bond a lower surface of the semiconductor chip (6) to the electrode (3).

A camera module is configured to capture an optical image of a target area and includes a lens member, an imager, a light transmitting member, and a seat. The lens member is configured to receive light from the target area. The imager has a curved portion convex in a direction away from the lens member and is configured to capture the optical image formed on the curved portion. The light transmitting member optically couples the lens member and the imager. The seat has a supporting portion that supports an outer rim of the imager and a fluid space defined inside the supporting portion. A heat dissipation fluid undergoes convection in the fluid space. The curved portion is interposed between the light transmitting member and the seat having the supporting portion and the fluid space.

Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.

A semiconductor package includes a package substrate having a first insulating layer, a wiring layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and covering at least a portion of the wiring layer, a pair of support members disposed to face each other on the second insulating layer of the package substrate, and a pair of semiconductor chips disposed between the pair of support members and electrically connected to the wiring layer, wherein the second insulating layer has an opening surrounding at least a portion of each of the pair of semiconductor chips.

Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments, the semiconductor device is an assembly that includes a package substrate having a front side and a backside opposite the front side. A controller die with a first longitudinal footprint can be attached to the front side of the package substrate. A passive electrical component is also attached to the front side of the package substrate. A stack of semiconductor dies can be attached to the controller die and the passive electrical component. The stack of semiconductor dies has a second longitudinal footprint greater than the first longitudinal footprint in at least one dimension. The controller die and the passive electrical component are positioned at least partially within the second longitudinal footprint, thereby at least partially supporting the stack of semiconductor dies.

A terminal connection portion, which includes an IC including a plurality of input bumps and a plurality of output bumps, and a terminal connection portion including a plurality of input terminal electrodes and a plurality of output terminal electrodes, is provided in a frame region, and in the terminal connection portion, an electrode insulating film is provided on the input terminal electrodes and the output terminal electrodes. A protruding portion is provided on the electrode insulating film, and the protruding portion overlaps with the IC in a plan view, and overlaps with the input bumps and the output bumps when viewed from a direction parallel to a substrate surface of a resin substrate layer.

According to an aspect of the present disclosure, a semiconductor device includes a base plate, a first semiconductor chip provided above the base plate, a bonding wire joined with the first semiconductor chip at a first joint part and having a curved part above the first joint part, a first sealing member provided from an upper surface of the base plate up to a height higher than the first joint part and lower than the curved part, the first sealing member covering the first joint part and a second sealing member provided on the first sealing member, covering the curved part, and having an elastic modulus lower than an elastic modulus of the first sealing member.