A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.

The Rds*Cgd figure of merit (FOM) of a laterally diffused metal oxide semiconductor (LDMOS) transistor is improved by forming the drain drift region with a number of dopant implants at a number of depths, and forming a step-shaped back gate region with a number of dopant implants at a number of depths to adjoin the drain drift region.

A method of forming a metal oxide semiconductor field effect transistor with improved gate-induced drain leakage performance, the method including providing a semiconductor substrate having a gate trench formed therein, performing an ion implantation process on upper portions of sidewalls of the gate trench to make the upper portions more susceptible to oxidation relative to non-implanted lower portions of the sidewalls, and performing an oxidation process on surfaces of the substrate, wherein the implanted upper portions of the sidewalls develop a thicker layer of oxidation relative to the non-implanted lower portions of the sidewalls.

The present disclosure provides a transistor device and a method for preparing the same. The transistor device includes an isolation structure disposed in a substrate, an active region disposed in the substrate and surrounded by the isolation structure, a first upper gate disposed over the active region and a portion of the isolation structure, a source/drain disposed at two sides of the gate, and a pair of first lower gates disposed under the first upper gate and isolated from the active region by the isolation structure. In some embodiments, the pair of first lower gates extend in a first direction, the first upper gate extends in a second direction, and the first direction and the second direction are different.

A method of manufacturing a semiconductor device in a semiconductor body having a first surface and a second surface is proposed. The method includes implanting protons through the second surface into the semiconductor body. The method further includes implanting ions through the second surface into the semiconductor body. The ions are ions of a non-doping element having an atomic number of at least 9. Thereafter, the method further includes processing the semiconductor body by thermal annealing.

A method includes forming a resist pattern, the resist pattern having trenches oriented lengthwise along a first direction and separated by resist walls along both the first direction and a second direction perpendicular to the first direction. The method further includes loading the resist pattern into an ion implanter so that a top surface of the resist pattern faces an ion travel direction, and tilting the resist pattern so that the ion travel direction forms a tilt angle with respect to an axis perpendicular to the top surface of the resist pattern. The method further includes rotating the resist pattern around the axis to a first position; implanting ions into the resist walls with the resist pattern at the first position; rotating the resist pattern around the axis by 180 degrees to a second position; and implanting ions into the resist walls with the resist pattern at the second position.

A shield gate trench MOSFET device includes a substrate and a trench in the substrate. A lower portion of the trench is filled with a shield gate dielectric layer and a first polysilicon layer. An upper portion of the trench is filled with a first dielectric layer, a second polysilicon layer, and a second dielectric layer. The second dielectric layer is located above the second polysilicon layer, and the top of the second polysilicon layer is lower than the surface of the substrate. A well region is located outside the trench, and a Schottky implantation region is located outside the well region. The bottom of the Schottky implantation region is higher than the bottom of the well region. The well region includes a source region and a well contact region. The well contact region is located between the source region and the Schottky implantation region.

A method for forming a semiconductor structure includes: providing a substrate, in which a gate structure is formed on the substrate; forming first side walls covering side surfaces of the gate structure, in which the first side walls have a first preset thickness in a direction parallel to a plane of the substrate; performing first ion implantation on the substrate on both sides of the gate structure exposed to the first side walls; removing a part of the first side walls to form second side walls, in which the second side walls have a second preset thickness in the direction parallel to the plane of the substrate; and performing second ion implantation on the substrate on both sides of the gate structure, in which doping types of the first ion implantation and the second ion implantation are different.

This application discloses an NMOS device and an integrated circuit. The NMOS device includes a semiconductor substrate, a gate oxide layer, and a gate. The semiconductor substrate includes a P well, a source region, a drain region, a first LDD region, and a second LDD region. The first LDD region and the second LDD region each include a first ion injection region and a second ion injection region. The first ion injection region is formed by injecting a first ion, and the first ion includes a P ion. The second ion injection region is formed by injecting a second ion into the first ion injection region, and the second ion includes a Ge ion.

A method includes: forming a gate over a semiconductor substrate; forming doped regions in the semiconductor substrate; depositing a dielectric layer on sidewalls of the gate, the dielectric layer including vertical portions laterally surrounding a sidewall of the gate; depositing a spacer laterally surrounding the dielectric layer, the spacer including a carbon-free portion laterally surrounding the vertical portions of the dielectric layer and a carbon-containing portion laterally surrounding the carbon-free portion; forming source/drain regions in the semiconductor substrate; performing an etching operation to remove the gate and vertical portions of the dielectric layer using the carbon-free portion as an etching stop layer to thereby expose the carbon-free portion and form a recess; and forming a gate dielectric layer and a conductive layer in the recess, wherein the gate dielectric layer extends in at least a portion of an area where the vertical portions of the dielectric layer are etched.