A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

A sheet sticking apparatus includes a sticking unit that sticks a sheet to a workpiece held by a chuck table and a cutting unit that cuts the stuck sheet. The cutting unit includes a cutting blade that cuts the sheet, a movement unit that raises and lowers the cutting blade from and toward the chuck table or moves the cutting blade along the outer circumference of the workpiece, and a cleaning part that removes adhering things of the cutting blade. The cleaning part is disposed on the trajectory of the cutting blade that moves by the movement unit and executes cleaning by coming into contact with the cutting blade that moves.

Disclosed is a substrate treating apparatus that performs a cleaning treatment on substrates. A treating block includes a plurality of treating units in an upper and lower stages, respectively. The treating block includes a front face cleaning unit and a back face cleaning unit, each being at least one in number, in the upper stage. The treating block includes at least one tower unit including the front face cleaning unit and the back face cleaning unit, each being at least one in number, in the lower stage. Moreover, a transportation block is provided that includes a center robot in each of the upper and lower stages.

A substrate cleaning apparatus configured to clean a surface of a substrate having a circular shape by bringing a cleaning member into contact with the surface of the substrate and rotating the substrate and the cleaning member relatively is provided. A contact region of the cleaning member which comes into contact with the surface of the substrate is widened in a radial shape from a center side of the substrate toward a peripheral side thereof.

A substrate treating apparatus and a substrate transporting method wherein a platform is disposed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. Accordingly, a substrate is transported in both a forward path and a return path between the first ID block and a second treating block. The substrate is returned not to the first ID block but to the second ID block disposed between the two treating blocks in the return path.

The present invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) includes a heater (51), a chemical-liquid diluting module (52), and a cleaning module. A temperature of the diluted-chemical-liquid mixed by the chemical-liquid diluting module (52) is determined to be higher than normal a temperature and lower than a glass transition point of a cleaning member. The cleaning member scrubs the substrate (W) with the diluted chemical liquid having the determined temperature supplied to the substrate (W).

The present disclosure relates to a fixture, the fixture is a fixture for a semiconductor etching machine, and the fixture includes: a support mechanism, configured to be arranged on an outer base of an electrostatic chuck of the semiconductor etching machine; a cleaning mechanism, being rotatably arranged on the support mechanism; and at least one cleaning unit, being arranged on the cleaning mechanism.

A wafer edge polishing apparatus includes a cleaning mechanism exhibiting a superb effect of cleaning slurry residue adhered on a chuck table. This edge polishing device is provided with: a chuck table which sucks/holds a wafer; a rotation drive mechanism which rotates the chuck table; an edge polishing unit which polishes an edge of the wafer while supplying slurry to the wafer, which is rotating while being sucked/held by the chuck table; and a cleaning unit which removes slurry residue on the chuck table. The cleaning unit includes a cleaning head, and cleans the chuck table through high-pressure cleaning and brush-cleaning by using the cleaning head, wherein the cleaning head is provided with a high-pressure jet nozzle and a brush surrounding the periphery of the high-pressure jet nozzle.

A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13.

The present disclosure relates to an apparatus and a method for wafer cleaning. The apparatus can include a wafer holder configured to hold a wafer; a cleaning nozzle configured to dispense a cleaning fluid onto a first surface (e.g., front surface) of the wafer; and a cleaning brush configured to clean a second surface (e.g., back surface) of the wafer. Using the cleaning fluid, the cleaning brush can clean the second surface of the wafer with a scrubbing motion and ultrasonic vibration.