A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.

A semiconductor package includes a semiconductor die, a tab, a first lead, and a continuous lead frame. The semiconductor die includes a first terminal, a second terminal, and a third terminal. The tab is electronically coupled to the first terminal. The semiconductor die is mounted on the tab. The first lead is electronically coupled to the second terminal. The continuous lead frame is electronically coupled to the third terminal and includes a second lead and a third lead.

A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.

A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.

The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.

The present invention provides a conductive material in which, even when the conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, yellowing of the conductive material can be sufficiently suppressed during heating. The conductive material according to the present invention contains a plurality of conductive particles having solder at an outer surface portion of a conductive portion, a curable compound, and a boron trifluoride complex.

Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor device 1 includes a device substrate 2, a semiconductor circuit 3, a sealing frame 7, a cap substrate 8, via portions 10, electrodes 11, 12 and 13, and a bump portion 14 or the like. A hollow portion 9 in which the semiconductor circuit 3 is housed in an airtight state is provided between the device substrate 2 and the cap substrate 8. The bump portion 14 connects all the via portions 10 and the cap substrate 8. Thus, the via portions 10 can be reinforced using the bump portion 14A.

Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor device 1 includes a device substrate 2, a semiconductor circuit 3, a sealing frame 7, a cap substrate 8, via portions 10, electrodes 11, 12 and 13, and a bump portion 14 or the like. A hollow portion 9 in which the semiconductor circuit 3 is housed in an airtight state is provided between the device substrate 2 and the cap substrate 8. The bump portion 14 connects all the via portions 10 and the cap substrate 8. Thus, the via portions 10 can be reinforced using the bump portion 14A.