Implementations of an image sensor package may include an image sensor die including at least one bond pad thereon; a bond wire wirebonded to the at least one bond pad; and an optically transmissive lid coupled to the image sensor die with an optically opaque film adhesive over the at least one bond pad. The bond wire may extend through the optically opaque film adhesive to the at least one bond pad.

A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.

Disclosed are a semiconductor package and a method of fabricating the same. The semiconductor package may include a semiconductor chip structure, a transparent substrate disposed on the semiconductor chip structure, a dam placed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip, which are in contact with each other, and the image sensor chip may be closer to the transparent substrate than the logic chip.

A display device includes a display substrate, a signal pad part, an insulating layer, a connection pad part, and an electronic component. The signal pad part includes first and second signal pad parts, which face each other in one direction. The insulating layer covers the signal pad part. The connection pad part is disposed on the insulating layer and includes a first connection pad part overlapping the first signal pad part and a second connection pad part. The second connection pad part is electrically connected to the first connection pad part and is in electrical contact with the second signal pad part through a contact hole defined in the insulating layer. The electronic component includes a bump that is in electrical contact with the first connection pad part. The first signal pad part includes a plurality of signal pad portions spaced apart from each other.

An image sensor package including an image sensor chip including an active pixel sensor region and a non-sensing region, a plurality of chip pads being in the non-sensing region; a printed circuit board on one side of the image sensor chip, the printed circuit board including a plurality of bonding pads; conductive wires respectively connecting the plurality of chip pads to the plurality of bonding pads; a bonding dam at a periphery of the active pixel sensor region; a cover glass on the bonding dam and facing another side of the image sensor chip; and an encapsulation layer covering a side surface of the bonding dam, a side surface of the cover glass, an edge of a lower surface of the cover glass, the non-sensing region, and an edge of an upper surface of the printed circuit board, wherein the bonding dam is spaced apart from an end of a side surface of the image sensor chip by a distance of 80 μm to 150 μm has a height of 50 μm to 150 μm from the image sensor chip, and has a width of 160 μm to 240 μm.

An adhesive member includes: a conductive particle layer including a plurality of conductive particles; a non-conductive layer disposed on the conductive particle layer; and a screening layer interposed between the conductive particle layer and the non-conductive layer and includes a plurality of screening members spaced apart from each other.

The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, a die and a first adhesive layer; a surface of the substrate is provided with an insulation layer; the die is arranged on a surface of the insulation layer via the first adhesive layer; the insulation layer is provided with at least one hole slot; a position of the at least one hole slot corresponds to at least a part of an edge of the first adhesive layer; a second adhesive layer is arranged in the at least one hole slot; at least a part of a surface of the second adhesive layer is connected with the first adhesive layer; and an elasticity modulus of the second adhesive layer is smaller than an elasticity modulus of the first adhesive layer.

The present disclosure provides a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate, a die and a first adhesive layer; a surface of the substrate is provided with an insulation layer; the die is arranged on a surface of the insulation layer via the first adhesive layer; the insulation layer is provided with at least one hole slot; a position of the at least one hole slot corresponds to at least a part of an edge of the first adhesive layer; a second adhesive layer is arranged in the at least one hole slot; at least a part of a surface of the second adhesive layer is connected with the first adhesive layer; and an elasticity modulus of the second adhesive layer is smaller than an elasticity modulus of the first adhesive layer.