The present application relates to a light emitting diode, a light emitting device, and a display device. The light emitting device includes a light emitting diode and a substrate; the substrate is coated with a bonding substance; the light emitting diode is provided with a positive electrode pad and a negative electrode pad; the surface of the positive electrode pad and/or the negative electrode pad is provided with a plurality of protrusions which are embedded in the bonding substance; and the positive electrode pads and the negative electrode pads are fixed to the substrate through the bonding substance. The embodiment of the present application provides projections on the pad of the light emitting diode, avoids the need of increasing the area of the pad, increases the contact area between the pad and the solder with the constant pad area, improves the bonding stability between the light emitting diode and the substrate, and reduces the production cost.

Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example integrated device includes a backplane device and different color light emitting diodes (LEDs) devices arranged in different height planar layers on the backplane device. The backplane device includes at least one backplane having a number of pixel circuits. Each LED device includes an array of LEDs each operable to emit light with a particular color and conductively coupled to respective pixel circuits in the backplane to form active-matrix LED sub-pixels. The different color LED sub-pixels form an array of active-matrix multi-color display pixels. Plug vias can be arranged in different planar layers to conductively couple upper-level LEDs to respective pixel circuits in respective regions over the backplane device. The plug vias can extend from an upper planar layer into a lower planar layer to fix the two planar layers together.

A semiconductor device includes a first electronic component, a second electronic component, a third electronic component, a plurality of first interconnection structures, and a plurality of second interconnection structures. The second electronic component is between the first electronic component and the third electronic component. The first interconnection structures are between and electrically connected to the first electronic component and the second electronic component. Each of the first interconnection structures has a length along a first direction substantially parallel to a surface of the first electronic component and a width along a second direction substantially parallel to the surface and substantially perpendicular to the first direction. The length is larger than the width. The second interconnection structures are between and electrically connected to the second electronic component and the third electronic component.

A display device includes a display panel including a display area in which pixels are provided, and a non-display area located on a side of the display area, a circuit board bonded to the display panel in the non-display area, and electrically connected to the pixels, an optical layer provided on the display panel in the display area, and a protective layer disposed on the display panel in the non-display area. A top surface of the protective layer includes a protrusion having an island shape, or a trace formed by removing at least a portion of the protrusion.

A display apparatus includes: a circuit board including a driving circuit; and a pixel array disposed on the circuit board and including pixels, each of the pixels having a plurality of sub-pixels. The pixel array includes: a semiconductor stack, a conductive partition structure and wavelength conversion portions. The semiconductor stack includes LED cells respectively constituting the plurality of sub-pixels. Each of the LED cells includes at least an active layer and a second conductivity-type semiconductor layer. The conductive partition structure is provided between sub-pixel spaces, respectively overlaps the LED cells on the semiconductor stack, and is provided as a first electrode. The wavelength conversion portions are respectively disposed on the sub-pixel spaces.

Disclosed are a micro light emitting diode display panel, a manufacturing method thereof and a display device. The embodiment micro light emitting diode display panel includes a first metal layer and a second metal layer; the first metal layer includes a source electrode, a drain electrode and a power line; the second metal layer includes a first bonding electrode and a second bonding electrode, and the first bonding electrode is electrically connected to the source electrode through the first via hole, and the second bonding electrode is electrically connected to the power line through the second via hole; the first via hole and the second via hole are both provided with a supporting column.

A display device includes electrodes spaced apart from each other in a display area, an insulating layer disposed on the electrodes, light emitting elements disposed between the electrodes on the insulating layer, a signal line electrically connected to the light emitting elements, and a pad electrode electrically connected to the signal line, the pad electrode and the electrodes being disposed on a same layer in a non-display area. The insulating layer includes an opening exposing the pad electrode, and the signal line does not overlap the opening of the insulating layer in plan view.

A display module is provided. The display module includes: a substrate partitioned into a plurality of pixel regions and including a plurality of electrode pads disposed in the pixel regions; a bonding member including an adhesive layer stacked on one surface of the substrate and a plurality of conductive balls disposed in the adhesive layer; and a plurality of light emitting diodes including electrodes connected to the plurality of electrode pads by the plurality of conductive balls, in which the plurality of conductive balls are patterned as a conductive region corresponding to the plurality of electrode pads.

A display device includes a driving member which provides an electrical signal and includes a connection terminal which transmits the electrical signal, a pad electrode which receives the electrical signal from the driving member and is electrically connected to the connection terminal of the driving member, an organic layer on the pad electrode, the organic layer including a side surface defining an opening of the organic layer which exposes the pad electrode to outside the organic layer and within the opening, a protrusion protruding from the side surface, and a connection conductive layer which electrically connects the pad electrode to the connection terminal, within the opening of the organic layer, where the connection conductive layer covers each of the pad electrode which is exposed by the opening of the organic layer, the side surface of the organic layer, and the protrusion of the organic layer.

A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1.sup.st-1.sup.st output pad group and a 1.sup.st-2.sup.nd output pad group, the second output pad region includes a 2.sup.nd-1.sup.st output pad group and a 2.sup.nd-2.sup.nd output pad group, the fourth output pad region includes a 4.sup.th-1.sup.st output pad group and a 4.sup.th-2.sup.nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1.sup.st-1.sup.st output pad group, a second input terminal electrically connected to the 2.sup.nd-2.sup.nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4.sup.th-2.sup.nd output pad group.