A anisotropic conductive film includes: an electrically insulating adhesive layer; electrically conductive particles disposed in lattice form in the electrically insulating adhesive layer; a reference electrically conductive particle defined, an electrically conductive particle closest to the reference electrically conductive particle defined as a first electrically conductive particle, an electrically conductive particle equally close or next closest to the reference electrically conductive particle regarding the first electrically conductive particle defined as a second electrically conductive particle. The second electrically conductive particle absent from lattice form axis including the reference electrically conductive particle and first electrically conductive particle. A projection image in the anisotropic conductive film longitudinal direction of the reference electrically conductive particle and first electrically conductive particle or second electrically conductive particle overlap and the anisotropic conductive film projection image in a short-side direction the reference electrically conductive particle and second electrically conductive particle or first electrically conductive particle overlap.

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.

According to an aspect, a display device includes: a substrate including a display region and a non-display region surrounding the display region; at least one driver IC including connecting terminals with a first surface fixed to face the non-display region; first wires supplying a signal to the display region; first bumps connected with the first wires; second wires transferring a signal to and from outside; second bumps connected with the second wires; and inspection wires. The connecting terminals of the driver IC include first connecting terminals overlapping the first or second bumps in plan view, and second connecting terminals not overlapping the first or second bumps in plan view. The inspection wires include a connecting conductor between themselves and at least one of the second connecting terminals. The inspection wires are pulled out to an outside of the driver IC in plan view.

Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

An electronic device includes a first electronic component and a second electronic component. The first electronic component includes a first pad area including first pads and second pads spaced apart from the first pads. A number of the first pads is greater than a number of the second pads. The second electronic component includes first bumps electrically connected to the first pads, and second bumps electrically connected to the second pads. Each of the second bumps has a bonding area greater than a bonding area of each of the first bumps. A conductive adhesive layer is disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first bumps.

The present disclosure provides a method of transferring an electronic element using a stamping and magnetic field alignment technology and an electronic device including an electronic element transferred using the method. In the present disclosure, a polymer may be simultaneously coated on a plurality of electronic elements using the stamping process, and the polymer may be actively coated on the electronic elements without restrictions on process parameters such as size and spacing of the electronic elements. Moreover, the self-aligned ferromagnetic particles have an anisotropic current flow through which current flows only in the aligned direction. Therefore, the current may flow only vertically between the electronic element and the electrode, and there is no electrical short circuit between a peripheral LED element and the electrode.

A semiconductor device has a first build-up interconnect structure formed over a substrate. The first build-up interconnect structure includes an insulating layer and conductive layer formed over the insulating layer. A vertical interconnect structure and semiconductor die are disposed over the first build-up interconnect structure. The semiconductor die, first build-up interconnect structure, and substrate are disposed over a carrier. An encapsulant is deposited over the semiconductor die, first build-up interconnect structure, and substrate. A second build-up interconnect structure is formed over the encapsulant. The second build-up interconnect structure electrically connects to the first build-up interconnect structure through the vertical interconnect structure. The substrate provides structural support and prevents warpage during formation of the first and second build-up interconnect structures. The substrate is removed after forming the second build-up interconnect structure. A portion of the insulating layer is removed exposing the conductive layer for electrical interconnect with subsequently stacked semiconductor devices.

In one implementation, a semiconductor package includes an integrated circuit (IC) attached to a die paddle segment of a first patterned conduct carrier and coupled to a switch node segment of the first patterned conductive carrier by an electrical connector. In addition, the semiconductor package includes a second patterned conductive carrier situated over the IC, a magnetic material situated over the second patterned conductive carrier, and a third patterned conductive carrier situated over the magnetic material. The second patterned conductive carrier and the third patterned conductive carrier are electrically coupled so as to form windings of an integrated inductor in the semiconductor package.