A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.

A semiconductor device has a first semiconductor die mounted over a carrier. An interposer frame has an opening in the interposer frame and a plurality of conductive pillars formed over the interposer frame. The interposer is mounted over the carrier and first die with the conductive pillars disposed around the die. A cavity can be formed in the interposer frame to contain a portion of the first die. An encapsulant is deposited through the opening in the interposer frame over the carrier and first die. Alternatively, the encapsulant is deposited over the carrier and first die and the interposer frame is pressed against the encapsulant. Excess encapsulant exits through the opening in the interposer frame. The carrier is removed. An interconnect structure is formed over the encapsulant and first die. A second semiconductor die can be mounted over the first die or over the interposer frame.

A method for manufacturing connection structure, the method includes arranging a first composite on a first surface of a first member where a first electrode is located and arranging conductive particles on the first electrode, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

The disclosure relates to the field of display technologies and particularly to a chip, a flexible display panel and a display device. The chip includes a body and a plurality of connection terminals arranged on a surface of the body, where each connection terminal is provided with a stress concentration resisting structure for preventing from producing the stress concentration phenomenon.

Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.

Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.

The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

A display device includes a first flexible substrate on which a display region and a peripheral region located along a periphery of the display region are arranged; a connection terminal provided in the peripheral region, the connection terminal being connected with an integrated circuit; and a first insulating film in contact with the first flexible substrate. The first insulating film is present in the display region, and the first insulating film is not present between the connection terminal and the first flexible substrate.

A display device includes a first flexible substrate on which a display region and a peripheral region located along a periphery of the display region are arranged; a connection terminal provided in the peripheral region, the connection terminal being connected with an integrated circuit; and a first insulating film in contact with the first flexible substrate. The first insulating film is present in the display region, and the first insulating film is not present between the connection terminal and the first flexible substrate.

A light emitting device is manufactured by bonding an LED element on a wiring board using an anisotropic conductive adhesive. In the manufacture, the anisotropic conductive adhesive is disposed on the wiring board, and the LED element is disposed thereon. A polymerizable epoxy-modified silicone resin and a metal chelate compound are contained in the anisotropic conductive adhesive in advance. A pressing unit is pressed against the LED element for a certain pressing time, while the temperature of the wiring board is kept at 160 C. or higher and 210 C. or lower, and the temperature of the pressing unit is set lower than that of the wiring board. Since the reaction between the epoxy-modified silicone resin and the metal chelate compound occurs at a low temperature, the LED element is temporarily connected to the wiring board without collapse of a fluorescent layer.