A display structure and a manufacturing method thereof are provided. The display structure includes a substrate, a display component layer, an insulating protective layer, a plurality of display signal lines, a plurality of first connecting pads and a flip-chip thin-film package, wherein the first connecting pads are disposed on a back surface of the substrate, and connected with the display signal lines; the flip-chip thin-film package has a plurality of second connecting pads electrically connecting to the first connecting pads. The connecting pads disposed on the flip-chip thin-film package are connecting to the connecting pads disposed on the back surface of the display panel, so that achieve no need to bend the display, thereby increasing a screen ratio of the display.

Various embodiments of the present application are directed towards a method for forming an integrated chip in which a group III-V device is bonded to a substrate, as well as the resulting integrated chip. In some embodiments, the method includes: forming a chip including an epitaxial stack, a metal structure on the epitaxial stack, and a diffusion layer between the metal structure and the epitaxial stack; bonding the chip to a substrate so the metal structure is between the substrate and the epitaxial stack; and performing an etch into the epitaxial stack to form a mesa structure with sidewalls spaced from sidewalls of the diffusion layer. The metal structure may, for example, be a metal bump patterned before the bonding or may, for example, be a metal layer that is on an etch stop layer and that protrudes through the etch stop layer to the diffusion layer.

A stack of electrical components has a first electrical component having a first surface, a second surface that is opposite to the first surface and a side surface that is located between the first surface and the second surface; a second electrical component having a third surface on which the first electrical component is mounted, the third surface facing the second surface and forming a corner portion between the third surface and the side surface; an adhesive layer that bonds the first electrical component to the second electrical component, the adhesive layer has a first portion that is located between the second and third surface and a second portion that is made of a same material as the first portion and that fills the corner portion; and a conductive layer that extends on a side of the side surface, curves along the second portion and extends to the third surface.

A display apparatus is provided, including a panel including a substrate including a display area where pixels are disposed, and a pad area where a terminal portion connected to the display area is disposed, and an insulating layer disposed over a same layer as in the display area and the pad area. A thickness of the insulating layer in the display area and a thickness of the insulating layer in the pad area are of different thicknesses.

The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

A display apparatus includes a substrate including a display region and a non-display region, a display element layer, a pad group, a touch electrode layer, and a touch insulating layer. The display element layer includes display elements provided in the display region in a plan view. The pad group may include output pads provided on substrate and provided in the non-display region in the plan view. The touch electrode layer is provided on the display element layer. The touch insulating layer is provided on the display element layer and contacts the touch electrode layer. An intaglio pattern is provided in the touch insulating layer overlapped with the non-display region, and the intaglio pattern is not overlapped with the pad group.

A stack of electrical components has a first electrical component having a first surface, a second surface that is opposite to the first surface and a side surface that is located between the first surface and the second surface; a second electrical component having a third surface on which the first electrical component is mounted, the third surface facing the second surface and forming a corner portion between the third surface and the side surface; an adhesive layer that bonds the first electrical component to the second electrical component, wherein the adhesive layer has a first portion that is located between the second surface and the third surface and a curved second portion that fills the corner portion; and a conductive layer that extends on a side of the side surface, curves along the second portion and extends to the third surface.

A method for forming a semiconductor device is provided. The method includes providing a substrate. The method includes forming a mask layer over a surface of the substrate. The mask layer has an opening over a portion of the surface. The method includes depositing a conductive layer over the surface and the mask layer. The method includes removing the mask layer and the conductive layer over the mask layer. The conductive layer remaining after the removal of the mask layer and the conductive layer over the mask layer forms a conductive pad. The method includes bonding a device to the conductive pad through a solder layer. The conductive pad is embedded in the solder layer.

A display device includes a display panel including a first signal pad and a second signal pad, a circuit board overlapped with the first and second signal pads, and an adhesive film overlapped with the first and second signal pads and disposed between the circuit board and the display panel. The adhesive film includes a base resin and a plurality of conductive balls dispersed in the base resin. The circuit board includes a first driving pad and a second driving pad. The first and second driving pads protrude toward the adhesive film and are arranged in a first direction. The first and second driving pads overlap with the first and second signal pads, respectively. The display device may be configured to satisfy the inequality:

[00001]$T\ge G+\frac{B\times S}{W+S}.$

The method for fabricating a device includes the following successive steps: providing a first substrate made from silicon of (100), (110) or (111) orientation, from a material of III-IV type or from a material of II-VI type, provided with at least one salient metal pad, and providing a second substrate; fixing the first substrate with the second substrate, the at least one metal pad forming a blocking means preventing movement beyond a threshold position; and performing an anneal of the metal pad so as to melt the metal pad and eliminate the blocking means.