A semiconductor package includes: a first semiconductor chip; a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip and each including a plurality of connection terminals arranged side-by-side in a horizontal direction of the semiconductor package; a center encapsulation layer between the plurality of second semiconductor chips and surrounding at least some of the plurality of connection terminals; and a package encapsulation layer on a top surface of the first semiconductor chip and surrounding the plurality of second semiconductor chips, wherein the center encapsulation layer does not contact an outermost connection terminal from among the plurality of connection terminals.