A multi-time programming non-volatile memory includes a select transistor, a floating gate transistor, a switch transistor, a capacitor and an erase gate element. The select transistor is connected with a select line and a source line. The floating gate transistor includes a floating gate. The floating gate transistor is connected with the select transistor. The switch transistor is connected with a word line, the floating gate transistor and a bit line. A first terminal of the capacitor is connected with the floating gate. A second terminal of the capacitor is connected with a control line. The erase gate element includes the floating gate, a gate oxide layer and a p-type region. The erase gate element is connected with an erase line. The floating gate of the erase gate element at least includes an n-type floating gate part.

The present application discloses a method for manufacturing a semiconductor device, which includes the following steps: step 1: forming first gate structures on a semiconductor substrate; step 2: performing a first etching process to etch the semiconductor substrate on at least one side of each first gate structure to a certain depth and form a first groove; step 3: performing a stress memorization process, including step 31: forming a stress dielectric layer, the stress dielectric layer covering a peripheral surface of each first gate structure and being filled in the first groove; step 32: performing annealing to transfer the stress of the stress dielectric layer to a channel region; step 33: removing the stress dielectric layer. The present application can increase the effect of transferring the stress of the stress dielectric layer to the channel region, thereby increasing the mobility of channel carriers.

A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A method for manufacturing a semiconductor structure includes forming a first dielectric layer on a substrate; forming a second dielectric layer on the first dielectric layer; using a photomask to apply a photoresist to cover a first part of the second dielectric layer; removing a second part of the second dielectric layer while retaining the first part of the second dielectric layer; and removing the photoresist. The first part of the second dielectric layer covers a first part of the first dielectric layer in a first area. The second part of the second dielectric layer covers a second part of the first dielectric layer in a second area. The first area is corresponding to a memory device. The second area is corresponding to a logic device.

Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Compensation measures can be utilized that compensate for changes in voltage or current as the number of cells being programmed changes.

A program method of a nonvolatile memory device that performs a plurality of program loops is provided. At least one of the plurality of program loops includes dividing a channel of a selected cell string into a first side channel and a second side channel during a first interval and a second interval, turning off a string selection transistor of the selected cell string by applying a string select line voltage of a first level during the first interval, and boosting a first voltage of the first side channel and a second voltage of the second side channel, and turning on the string selection transistor by applying the string select line voltage of a second level different from the first level during the second interval, and performing a hot carrier injection (HCI) program operation on a selected memory cell corresponding to the first side channel or the second side channel.

Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. In one example, a method for programming a plurality of non-volatile memory cells in an array of non-volatile memory cells, comprises generating a high voltage, and programming a plurality of non-volatile memory cells in an array using the high voltage when a programming enable signal is asserted and providing a feedback loop to maintain the high voltage while programming the plurality of non-volatile memory cells.

A method of forming a memory device that includes forming a first polysilicon layer using a first polysilicon deposition over a semiconductor substrate, forming an insulation spacer on the first polysilicon layer, and removing some of the first polysilicon layer to leave a first polysilicon block under the insulation spacer. A source region is formed in the substrate adjacent a first side surface of the first polysilicon block. A second polysilicon layer is formed using a second polysilicon deposition. The second polysilicon layer is partially removed to leave a second polysilicon block over the substrate and adjacent to a second side surface of the first polysilicon block. A third polysilicon layer is formed using a third polysilicon deposition. The third polysilicon layer is partially removed to leave a third polysilicon block over the source region. A drain region is formed in the substrate adjacent to the second polysilicon block.

A flash memory cell includes a rectifying device and a transistor. The rectifying device has an input end coupled to a bit line. The transistor has a charge storage structure. The transistor has a first end coupled to an output end of the rectifying device, the transistor has a second end coupled to a source line, and a control end of the transistor is coupled to a word line.

A nonvolatile memory device is provided. The nonvolatile memory device comprises a floating gate arranged over a first active region, whereby the first active region is in an active layer of a substrate. A metal-insulator-metal (MIM) capacitor may be provided laterally adjacent to the floating gate, whereby a portion of the metal-insulator-metal capacitor is in the active layer. A contact pillar may connect a first electrode of the metal-insulator-metal capacitor to the floating gate.