H01L29/78624

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
20210183982 · 2021-06-17 · ·

A display device and a manufacturing method thereof are disclosed. The display device includes a base substrate and at least one pixel circuit provided on the base substrate. The pixel circuit includes a driving transistor, a first transistor, and a second transistor; the base substrate includes a semiconductor body that can be doped, and a first conductive layer and a second conductive layer that are on the semiconductor body; the first transistor includes a first doped region in contact with the first electrode of the first transistor, and a second doped region in contact with a second electrode of the first transistor, and the first doped region of the first transistor and the second doped region of the first transistor are spaced apart from each other, have a same doping type, and are both in the semiconductor body.

Extended-drain field-effect transistors including a floating gate
11127860 · 2021-09-21 · ·

Structures for an extended-drain field-effect transistor and methods of forming an extended-drain field-effect transistor. A source region is coupled to a semiconductor layer, a drain region is coupled to the semiconductor layer, and a first gate structure is positioned over a channel region of the semiconductor layer. An extended drain region is positioned between the channel region and the drain region. The extended drain region includes a portion of the semiconductor layer between the first gate structure and the drain region. A second gate structure is arranged over the portion of the semiconductor layer.

Transistor and manufacturing method

The present technology relates to a transistor and a manufacturing method that make it possible to reduce noise. The transistor includes a gate electrode, a source region, and a drain region. The gate electrode is formed on a semiconductor substrate. The source region is formed on a surface of the semiconductor substrate and extended from the gate electrode. The drain region is positioned to oppose the source region and formed on the surface of the semiconductor substrate without being brought into contact with the gate electrode. The source region and the drain region are asymmetrical. The drain region is formed at a position deeper than the source region. At a gate end of the gate electrode, the drain region is formed at a distance from the surface of the semiconductor substrate. The present technology is applicable, for example, to an amplifying transistor.

Display device having a compensation transistor with a second region having greater electrical resistance than a first region

A display device includes scan lines for scan signals, data lines for data voltages, and pixels connected to the scan and data lines, where each of the pixels includes a first transistor configured to control a driving current which flows from a first electrode to a second electrode according to a voltage applied to a gate electrode, a light-emitting element connected to the second electrode and configured to emit light according to the driving current, and a third transistor electrically connected between the gate electrode and the second electrode, the third transistor includes an active layer including a first region connected to the second electrode of the first transistor, a second region connected to the gate electrode of the first transistor, and a channel region between the first region and the second region, and electrical resistance of the second region is greater than electrical resistance of the first region.

High voltage switching device

A high-voltage switching device that can be fabricated in a standard low-voltage process, such as CMOS, and more specifically SOI CMOS. Embodiments include integrated circuits that combine, in a unitary structure, a FET device and an integrated, co-fabricated modulated resistance region (MRR) controlled by one or more Voltage-Drop Modulation Gates (VDMGs). The VDMGs are generally biased independently of the gate of the FET device, and in such a way as to protect each VDMG from excessive and potentially destructive voltages. In a first embodiment, an integrated circuit high voltage switching device includes a transistor structure including a source, a gate, and an internal drain; an MRR connected to the internal drain of the transistor structure; at least one VDMG that controls the resistance of the MRR; and a drain electrically connected to the MRR. Each VDMG at least partially depletes the MRR upon application of a bias voltage.

Laterally double diffused metal oxide semiconductor (LDMOS) device on fully depleted silicon on insulator (FDSOI) enabling high input voltage

The present disclosure relates to semiconductor structures and, more particularly, to an LDMOS device on FDSOI structures and methods of manufacture. The laterally double diffused semiconductor device includes a gate dielectric composed of a buried insulator material of a semiconductor on insulator (SOI) technology, a channel region composed of semiconductor material of the SOI technology and source/drain regions on a front side of the buried insulator material such that a gate is formed on a back side of the buried insulator material. The gate terminal can also be placed at a hybrid section used as a back-gate voltage to control the channel and the drift region of the device.

EXTENDED-DRAIN FIELD-EFFECT TRANSISTORS INCLUDING A FLOATING GATE
20210083095 · 2021-03-18 ·

Structures for an extended-drain field-effect transistor and methods of forming an extended-drain field-effect transistor. A source region is coupled to a semiconductor layer, a drain region is coupled to the semiconductor layer, and a first gate structure is positioned over a channel region of the semiconductor layer. An extended drain region is positioned between the channel region and the drain region. The extended drain region includes a portion of the semiconductor layer between the first gate structure and the drain region. A second gate structure is arranged over the portion of the semiconductor layer.

Self-aligned high voltage transistor
10950721 · 2021-03-16 · ·

Certain aspects of the present disclosure generally relate to a transistor having a self-aligned drift region and asymmetric spacers. One example transistor generally includes a channel region; a gate region disposed above the channel region; a first implant region; a second implant region having a same doping type as the first implant region, but a different doping type than the channel region; a first spacer disposed adjacent to a first side of the gate region; a second spacer disposed adjacent to a second side of the gate region and having a wider width than the first spacer; and a drift region having an edge vertically aligned with an edge of the second spacer and disposed between the channel region and the second implant region. The channel region may be disposed between the first implant region and the drift region.

DISPLAY DEVICE
20210066429 · 2021-03-04 ·

A display device includes scan lines for scan signals, data lines for data voltages, and pixels connected to the scan and data lines, where each of the pixels includes a first transistor configured to control a driving current which flows from a first electrode to a second electrode according to a voltage applied to a gate electrode, a light-emitting element connected to the second electrode and configured to emit light according to the driving current, and a third transistor electrically connected between the gate electrode and the second electrode, the third transistor includes an active layer including a first region connected to the second electrode of the first transistor, a second region connected to the gate electrode of the first transistor, and a channel region between the first region and the second region, and electrical resistance of the second region is greater than electrical resistance of the first region.

DISPLAY DEVICE
20210036032 · 2021-02-04 ·

A display device includes pixel circuits disposed in a display area and a driving circuit disposed in the peripheral area. The driving circuit includes a first transistor and each pixel circuit includes a second transistor. The first transistor includes a first active pattern disposed on the substrate, a first gate insulation layer having a first outer portion disposed on the first active pattern, and a first gate electrode disposed on the first gate insulation layer. The second transistor includes a second active pattern disposed on the substrate, a second gate insulation layer having a second outer portion disposed on the second active pattern, and a second gate electrode disposed on the second gate insulation layer. The first outer portion doesn't overlap the first gate electrode and has a first width. The second outer portion doesn't overlap the second gate electrode and has a second width smaller than the first width.