An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.

A package structure and a formation method of a package structure are provided. The method includes disposing a chip structure over a substrate and forming a first adhesive element directly on the chip structure. The first adhesive element has a first thermal conductivity. The method also includes forming a second adhesive element directly on the chip structure. The second adhesive element has a second thermal conductivity, and the second thermal conductivity is greater than the first thermal conductivity. The method further includes attaching a protective lid to the chip structure through the first adhesive element and the second adhesive element.

Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

Disclosed are exemplary embodiments of compressible foamed thermal interface materials. Also disclosed are methods of making and using compressible foamed thermal interface materials.

A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet, the sheet includes: a sheet body formed by curing a thermally conductive resin composition containing at least a polymer matrix component and a thermally conductive filler, wherein the volume ratio of the thermally conductive filler to the polymer matrix component is 1.00 to 1.70, the thermally conductive filler contains a fibrous thermally conductive filler, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the polymer matrix component.

System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

System-in-package (SiP) devices are disclosed that include power amplifiers and controllers such as beamformer integrated circuits that are packaged together. Packaging and thermal management configurations are disclosed that allow a plurality of power amplifiers and a beamformer integrated circuit to operate efficiently while in close proximity to one another. SiP devices are disclosed that include heat spreaders that are incorporated within the SiP devices and exposed at top surfaces of the SiP devices to effectively dissipate heat. Heat spreaders may be provided as part of a lead frame that allows multiple SiP devices to be uniformly assembled with dimensions sized for high frequency applications, including millimeter wave operation.

A package structure is provided. The package structure includes a die, a lead frame, and a conductive glue. The lead frame includes a die pad and a retaining wall structure. The die pad is configured to support the die, and the retaining wall structure surrounds the die. The conductive glue is disposed between the die and the lead frame.

A package structure is provided. The package structure includes a die, a lead frame, and a conductive glue. The lead frame includes a die pad and a retaining wall structure. The die pad is configured to support the die, and the retaining wall structure surrounds the die. The conductive glue is disposed between the die and the lead frame.