Anisotropic conductive films, each including an insulating adhesive layer and conductive particles insulating adhesive layer in a lattice-like manner. Among center distances between an arbitrary conductive particle and conductive particles adjacent to the conductive particle, the shortest distance to the conductive particle is a first center distance; the next shortest distance is a second center distance. These center distances are 1.5 to 5 times the conductive particles' diameter. The arbitrary conductive particle, conductive particle spaced apart from the conductive particle by the first center distance, conductive particle spaced apart from the conductive particle by first center distance or second center distance form an acute triangle. Regarding this acute triangle, an acute angle formed between a straight line orthogonal to a first array direction passing through the conductive particles and second array direction passing through conductive particles being 18 to 35°. These anisotropic conductive films have stable connection reliability in COG connection.

An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

An anisotropic conductive film includes a conductive particle array layer in which a plurality of conductive particles are arrayed in a prescribed manner and held in an insulating resin layer. The anisotropic conductive film has a direction in which a thickness distribution, around the individual conductive particle, of the insulating resin layer holding the array of the conductive particles is asymmetric with respect to the conductive particle. The direction in which the thickness distribution is asymmetric is aligned in the same direction in the plurality of conductive particles. When an electronic component is mounted using this anisotropic conductive film, short circuits and conductive failure can be reduced.

An anisotropic conductive film in which conductive particles are disposed in an insulating resin layer has a particle disposition of the conductive particles such that a first orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in an a direction at a predetermined pitch, in a b direction inclined with respect to the a direction at an angle, and a second orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in the a direction at a predetermined pitch, in a c direction obtained by inverting the b direction with respect to the a direction are repeatedly disposed. Regardless of the shape of the terminal arrangements and the materials of electronic components, a good conduction state is ensured while the respective terminals hold conductive particles. Further, the occurrence of a short circuit is prevented.

An anisotropic conductive film in which conductive particles are disposed in an insulating resin layer has a particle disposition of the conductive particles such that a first orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in an a direction at a predetermined pitch, in a b direction inclined with respect to the a direction at an angle, and a second orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in the a direction at a predetermined pitch, in a c direction obtained by inverting the b direction with respect to the a direction are repeatedly disposed. Regardless of the shape of the terminal arrangements and the materials of electronic components, a good conduction state is ensured while the respective terminals hold conductive particles. Further, the occurrence of a short circuit is prevented.

A filler-containing film that holds fillers and a fine solid in an insulating resin layer and a predetermined arrangement of the fillers is repeated as viewed in a plan view has a proportion of 300% or less where the proportion is a repeat pitch of the fillers after thermocompression bonding to that before thermocompression bonding during thermocompression bonding under a predetermined thermocompression bonding condition with the filler-containing film held between smooth surfaces. A method of producing the filler-containing film includes the steps of: forming an insulating resin layer on a release substrate; pushing fillers from a surface on a side opposite to the release substrate of the insulating resin layer; and layering the insulating resin layer containing the fillers pushed and another insulating resin layer. This filler-containing film suppresses disorder of arrangement of fillers during thermocompression bonding of the film to an article.

A filler-containing film that holds fillers and a fine solid in an insulating resin layer and a predetermined arrangement of the fillers is repeated as viewed in a plan view has a proportion of 300% or less where the proportion is a repeat pitch of the fillers after thermocompression bonding to that before thermocompression bonding during thermocompression bonding under a predetermined thermocompression bonding condition with the filler-containing film held between smooth surfaces. A method of producing the filler-containing film includes the steps of: forming an insulating resin layer on a release substrate; pushing fillers from a surface on a side opposite to the release substrate of the insulating resin layer; and layering the insulating resin layer containing the fillers pushed and another insulating resin layer. This filler-containing film suppresses disorder of arrangement of fillers during thermocompression bonding of the film to an article.

An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.

The anisotropic conductive film of the present invention includes a resin base tape and a plurality of composite fibers disposed laterally in the resin base tape, wherein each of the composite fibers includes an electrically insulating fiber and a plurality of conductive rings circling the electrically insulating fiber, the conductive rings including a plurality of conductive particles collectively surrounding the electrically insulating fiber by adsorption, wherein the plurality of composite fibers are periodically arranged in the resin base tape along the extending direction of the resin base tape, and the plurality of conductive rings on each of the composite fibers are periodically arranged along the axial direction of the electrically insulating fiber thereof.