A semiconductor device has a substrate and an adhesive layer with a graphene core shell deposited over a surface of the substrate. An electrical component is affixed to the substrate with the adhesive layer. A bond wire is connected between the electrical component and substrate. The graphene core shell has a copper core and graphene coating over the copper core. The graphene coated core shell is embedded within a matrix. The graphene core shells within the adhesive layer to form a thermal path. The matrix can be a thermoset material or polymer or composite epoxy type matrix. The graphene core shell is embedded within the thermoset material or polymer or composite epoxy type matrix. The adhesive layer with graphene core shell is useful for die attachment. The graphene core adhesive layer provides exceptional heat dissipation, shock absorption, and vibration dampening.

Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.

Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.

Provided is copper paste for joining including metal particles, and a dispersion medium. The metal particles include sub-micro copper particles having a volume-average particle size of 0.12 m to 0.8 m, and micro copper particles having a volume-average particle size of 2 m to 50 m, a sum of the amount of the sub-micro copper particles contained and the amount of the micro copper particles contained is 80% by mass or greater on the basis of a total mass of the metal particles, and the amount of the sub-micro copper particles contained is 30% by mass to 90% by mass on the basis of a sum of a mass of the sub-micro copper particles and a mass of the micro copper particles.

A metal preparation is provided which contains (A) 40 to <80% by weight of at least one metal in the form of particles having a coating that contains at least one organic compound, and (B) >20 to 50 by weight organic solvent.

A metal preparation is provided which contains (A) 40 to <80% by weight of at least one metal in the form of particles having a coating that contains at least one organic compound, and (B) >20 to 50 by weight organic solvent.