A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.

A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component.

A light emitting apparatus includes a positive lead terminal and a negative lead terminal, each of which includes a first main surface, a second main surface, and an end surface including a first recessed surface area extending from a first point of the first main surface in cross section, and a second recessed surface area extending from a second point of the second main surface in cross section. A distance between a first part of the end surface of the positive lead terminal and a second part of the end surface of the negative lead terminal than a first distance between the first points of the positive lead terminal and the negative lead terminal and a second distance between the second points of the positive lead terminal and the negative lead terminal. The first part and the second part are separated from the first point and the second point.

A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly.

Several embodiments of the present technology are described with reference to a semiconductor die assembly and processes for manufacturing the assembly. In some embodiments of the present technology, a semiconductor die assembly includes a stack of semiconductor dies attached to a thermal transfer structure (also known as a heat spreader, lid, or thermal lid). The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls fabricated with molding material to support the thermal transfer structure.

A semiconductor module includes a first power semiconductor device, a conductive wire, and a resin film. The conductive wire is joined to a surface of a first front electrode of the first power semiconductor device. The resin film is formed to be continuous on at least one of an end portion or an end portion of a first joint between the first front electrode and the conductive wire in a longitudinal direction of the conductive wire, a surface of the first front electrode, and a surface of the conductive wire. The resin film has an elastic elongation rate of 4.5% to 10.0%.

A semiconductor module includes a first power semiconductor device, a conductive wire, and a resin film. The conductive wire is joined to a surface of a first front electrode of the first power semiconductor device. The resin film is formed to be continuous on at least one of an end portion or an end portion of a first joint between the first front electrode and the conductive wire in a longitudinal direction of the conductive wire, a surface of the first front electrode, and a surface of the conductive wire. The resin film has an elastic elongation rate of 4.5% to 10.0%.

A light emitting device mount includes a positive lead terminal, and a negative lead terminal. Each of the positive and negative lead terminal includes a first main surface, a second main surface, and an end surface. The end surface is provided between the first main surface and the second main surface. The end surface includes a first recessed surface area and a second recessed surface area. The first recessed surface area is extending from a first point of the first main surface in cross section. The second recessed surface area is extending from a second point of the second main surface in cross section. The first and second recessed surface areas define a protruding portion protruding outwardly.