Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.

Disclosed herein are electrically conductive adhesives (ECA) comprising: (a) organic binder, (b) electrically conductive powders comprised of surface coated spherical copper particles and surface coated flaky copper particles, and optional (c) solvent.

Provided is a bonding joining structure in which a heat generating body and a support including a metal are joined to each other via a joint portion composed of a sintered body of copper powder. The support contains copper or gold, the copper or gold being present in at least an outermost surface of the support. An interdiffusion portion in which copper or gold contained in the support and copper contained in the sintered body is formed so as to straddle a bonding interface between the support and the sintered body. Preferably, a copper crystal structure having the same crystal orientation is formed in the interdiffusion portion so as to straddle the bonding interface.

Provided is a bonding joining structure in which a heat generating body and a support including a metal are joined to each other via a joint portion composed of a sintered body of copper powder. The support contains copper or gold, the copper or gold being present in at least an outermost surface of the support. An interdiffusion portion in which copper or gold contained in the support and copper contained in the sintered body is formed so as to straddle a bonding interface between the support and the sintered body. Preferably, a copper crystal structure having the same crystal orientation is formed in the interdiffusion portion so as to straddle the bonding interface.

A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.