Y02E10/548

GERMANIUM-SILICON LIGHT SENSING APPARATUS II

A circuit that includes: a photodiode configured to absorb photons and to generate photo-carriers from the absorbed photons; a first MOSFET transistor that includes: a first channel terminal coupled to a first terminal of the photodiode and configured to collect a portion of the photo-carriers generated by the photodiode; a second channel terminal; and a gate terminal coupled to a first control voltage source; a first readout circuit configured to output a first readout voltage; a second readout circuit configured to output a second readout voltage; and a current-steering circuit configured to steer the photo-carriers generated by the photodiode to one or both of the first readout circuit and the second readout circuit.

SEMI-TRANSPARENT THIN-FILM PHOTOVOLTAIC DEVICE PROVIDED WITH AN OPTIMIZED METAL/NATIVE OXIDE/METAL ELECTRICAL CONTACT
20210242359 · 2021-08-05 ·

A thin-film semi-transparent photovoltaic device comprising: a plurality of active photovoltaic zones, having a surface S.sub.5, formed of: a transparent substrate; a front electrode formed of a transparent electroconductive material arranged on the transparent substrate; an absorber made up of one or more photoactive thin layer(s); a rear electrode formed of a stack of at least: a conductive metal layer; and a native metal oxide layer having a nanometric thickness. The device additionally includes a plurality of transparent zones separating at least two active photovoltaic zones; and a metal reconnection layer having a contact surface S to the rear electrode, wherein the ratio R.sub.a=S/S.sub.5 between the contact surface S of the metal reconnection layer and the surface S.sub.5 of an active photovoltaic zone is such that 0.2%<R.sub.a<2%.

Laser-assisted manufacturing system and associated method of use

A laser-assisted microfluidics manufacturing process has been developed for the fabrication of additively manufactured structures. Roll-to-roll manufacturing is enhanced by the use of a laser-assisted electrospray printhead positioned above the flexible substrate. The laser electrospray printhead sprays microdroplets containing nanoparticles onto the substrate to form both thin-film and structural layers. As the substrate moves, the nanoparticles are sintered using a laser beam directed by the laser electrospray printhead onto the substrate.

SOLAR CELL AND MANUFACTURING METHOD THEREOF

Provided are a solar cell and a method of manufacturing the same. The solar cell includes a substrate, a first electrode on the substrate, a second electrode on the first electrode, and at least one semiconductor layer interposed between the first and second electrodes, and a first connection layer interposed between the first electrode and the semiconductor layer and electrically connecting the first and second electrodes to each other. The first connection layer includes a plurality of two-dimensional layers vertically extending from a top surface of the first electrode to a bottom surface of the semiconductor layer. The two-dimensional layers include a metal compound.

Optoelectronic devices manufactured using different growth substrates

A growth structure having a lattice transition (or graded buffer) or an engineered growth structure with a desired lattice constant, different from a lattice constant of conventional substrates like GaAs, Si, Ge, InP, under a release layer or an etch stop layer is used as a seed crystal for growing optoelectronic devices. The optoelectronic device can be a photovoltaic device having one or more subcells (e.g., lattice-matched or lattice-mismatched subcells). The release layer can be removed using different processes to separate the optoelectronic device from the growth structure, which may be reused, or from the engineered growth structure. When using the etch stop layer, the growth structure or the engineered growth structure may be grinded or etched away. The engineered growth structure may be made from a layer transfer process between two wafers or from a ternary and/or a quaternary material. Methods for making the optoelectronic device are also described.

Buried activated p-(Al,In)GaN layers

Methods for fabricating semiconductor devices incorporating an activated p-(Al,In)GaN layer include exposing a p-(Al,In)GaN layer to a gaseous composition of H.sub.2 and/or NH.sub.3 under conditions that would otherwise passivate the p-(Al,In)GaN layer. The methods do not include subjecting the p-(Al,In)GaN layer to a separate activation step in a low hydrogen or hydrogen-free environment. The methods can be used to fabricate buried activated n/p-(Al,In)GaN tunnel junctions, which can be incorporated into electronic devices.

Electrophoretic deposition (EPD) of radioisotope and phosphor composite layer for hybrid radioisotope batteries and radioluminescent surfaces

An electrophoretic deposition (EPD) process forms a radioluminescent phosphor and radioisotope composite layer on a conductive surface of a substrate. In the composite layer formed, the particles of radioisotope are homogeneously dispersed with the radioluminescent phosphor. The radioisotope may be a beta-emitter, such as Ni-63, H-3, Pm-147, or Sr-90/Y-90. By applying the composite layer using the EPD process, the electrode can be configured for betavoltaic, beta-photovoltaic and photovoltaic cells according to further embodiments. A direct bandgap semiconductor device can convert betas and/or photons emitted from composite layer. Methods and choice of materials and components produces a hybrid radioisotope battery, conversion of photons and nuclear decay products, or radioluminescent surfaces.

MICROSTRUCTURE ENHANCED ABSORPTION PHOTOSENSITIVE DEVICES
20210242354 · 2021-08-05 ·

Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.

Solar cell and method for manufacturing the same

A method for manufacturing a solar cell can include forming a tunneling layer on first and second surfaces of a semiconductor substrate, the tunneling layer including a dielectric material; forming a polycrystalline silicon layer on the tunnel layer at the first surface and on the second surface of the semiconductor substrate; removing portions of the tunnel layer and the polycrystalline silicon layer formed at the first surface of the semiconductor substrate; forming a doping region at the first surface of the semiconductor substrate by diffusing a dopant; forming a passivation layer on the polycrystalline silicon layer at the second surface of the semiconductor substrate; and forming a second electrode connected to the polycrystalline silicon layer by penetrating through the passivation layer.

METAMORPHIC LAYERS IN MULTIJUNCTION SOLAR CELLS
20210193858 · 2021-06-24 · ·

A method of forming a multijunction solar cell that includes an InGaAs buffer layer and an InGaAlAs grading interlayer disposed below, and adjacent to, the InGaAs buffer layer. The grading interlayer achieves a transition in lattice constant from one solar subcell to another adjacent solar subcell.