An air-to-air cooler has a heat exchanger integrated to a housing. A first passage extends through the housing for directing a flow of cooling air through the heat exchanger. A second passage extends through the housing for directing a flow of hot air to be cooled through the heat exchanger. The first passage has a cooling air outlet tube disposed downstream of the heat exchanger. The cooling air outlet tube extends across the second passage between the heat exchanger and a hot air inlet of the second passage. The hot air inlet is disposed to cause incoming hot air to flow over the cooling air outlet tube upstream of the heat exchanger. An ejector drives the flow of cooling air through the first passage of the air-to-air cooler. A portion of the hot air flow may be used to drive the ejector.

A bent heat exchanger includes a first manifold, a second manifold, and a plurality of flat tubes each being configured to communicate the first manifold with the second manifold, and fins between the flat tubes; wherein the flat tube includes a first straight section, a second straight section and a bent section connecting the first straight section with the second straight section. The bent section includes the first twisted section connected to the first straight section, the second twisted section connected to the second straight section, and the connecting section connecting the first twisted section with the second twisted section, and the connecting section of the flat tube has a substantially flat shape or a flat arc shape. In this way, the height of the bent heat exchanger can be reduced, which facilitates the installation and improves the heat exchange performance of the heat exchanger.

Methods for making heat transfer devices include forming a jet plate with a plurality of inclined jets set at an angular deviation from normal. A bottom plate is formed with channel walls that have ribs. The jet plate is attached to the bottom plate to form ribbed channels. The angular deviation of each inclined jet establishes a jet direction perpendicular to a long dimension of the ribbed channels.

A fill in a rectilinear evaporative cooling tower includes a grid, grid support, module radial support, module column and module girts. The grid is to support a plurality of splash bars. The grid support is configured to provide support for the grid. The module support is configured to provide support for the grid support. The module column is configured to provide support for the module support. The module girts is configured to rest on a fill support frame of the rectilinear evaporative cooling tower and configured to provide support for the module columns.

A heat sink comprises a heat sink body, which in some embodiments is a plastic heat sink body, and a thermally conductive layer disposed over the heat sink body. In some embodiments the thermally conductive layer comprises a copper layer. A light emitting diode (LED)-based lamp comprises the aforementioned heat sink and an LED module including one or more LED devices in which the LED module is secured with and in thermal communication with the heat sink. Some such LED-based lamps may have an A-line bulb configuration or an MR or PAR configuration. Disclosed method embodiments comprise forming a heat sink body and disposing a thermally conductive layer on the heat sink body. The forming may comprise molding the heat sink body, which may be plastic. In some method embodiments the heat sink body includes fins and the disposing includes disposing the thermally conductive layer over the fins.

Modular air cooled condenser apparatus and related methods are disclosed. An example mechanical draft modular air cooled condenser disclosed herein includes an example condenser module that includes a plenum and a first condenser bundle having a first set of tubes having first ends and second ends and a first condensate header connected to the second ends of the tubes. The example condenser module also includes a second condenser bundle having a second set of tubes having third ends and fourth ends and a second condensate header connected to the fourth ends of the second set of tubes. In addition, the condenser module includes a third condenser bundle having a third set of tubes having fifth ends and sixth ends and a third condensate header connected to the sixth ends of the third set of tubes. The condenser module also includes a fourth condenser bundle having a fourth set of tubes having seventh ends and eighth ends and a fourth condensate header connected to the eighth ends of the fourth set of tubes. The condenser module further includes a shroud that houses a single fan, the single fan positioned to create a draft to flow over the first condenser bundle, over the second condenser bundle, over the third condenser bundle, and over the fourth condenser bundle. In addition, the condenser module includer a support frame that supports the first, second, third, and fourth condenser bundles.

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

A hybrid plate-fin heat exchanger for exchanging heat between a first fluid and a second fluid is disclosed. The hybrid plate-fin heat exchanger comprises a plurality of plates, each of which comprises channels for conveying the first fluid. Fins are brazed onto each plate, wherein the fins define a plurality of flow channels for the second fluid. The plates are joined to one another via friction-stir welding in such a way that the brazed regions are fluidically isolated from the first fluid during operation. As a result, the heat exchanger is suitable for use in applications that use a first fluid, such as seawater or geothermal fluid, which is corrosive for the brazed regions.

A formable structure comprises a first material having a first level of viscosity and a second material having a second level of viscosity, wherein the second material is formed to hold at least a portion of the first material in a particular position or a particular shape. The first material can be configured to function as a thermal interface between two or more hardware components. The second material can be configured to have a higher viscosity than the first material. In one illustrative example, the second material can include a light-activated resin that is configured to harden when exposed to one or more treatments. By the use of the first material and second material, the techniques disclosed herein are adaptable to gaps having a wide range of sizes, which is difficult to do with traditional thermal interface materials. The second material can also function as an EMI shield.

A thermal energy storage apparatus, including: a block of a heat-absorbing material, and a plurality of heat storage elements, the heat storage elements including a phase change material stored in a containment vessel; wherein each heat storage element is in thermal contact with the block of heat-absorbing material.