An electronic package comprising a first substrate; a second substrate; at least one standoff substrate positioned between the first substrate and the second substrate, wherein the at least one standoff substrate is affixed to each of the first substrate and the second substrate, wherein the at least one standoff substrate forms a clearance between the first substrate and the second substrate, and wherein the at least one standoff substrate comprises an intervening plurality of through-substrate vias passing through the entire thickness of the at least one standoff substrate, and wherein a portion of the second plurality of through-substrate vias are electrically connected to a portion of the first through-substrate vias by way of a portion of the intervening through-substrate vias; and at least three electronic components located within the clearance.

A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Methods and systems for stacking multiple chips with high speed serializer/deserializer blocks are presented. These methods make use of Through Via (TV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serializer/deserializer blocks, using the TVs.

Methods and systems for stacking multiple chips with high speed serialiser/deserialiser blocks are presented. These methods make use of Through Silicon Via (TSV) to connect the dice to each other, and to the external pads. The methods enable efficient multilayer stacking that simplifies design and manufacturing, and at the same time, ensure high speed operation of serialiser/deserialiser blocks, using the TSVs.

A working apparatus includes a component holder that holds a component and mounts the component at a predetermined position of a work. In the working apparatus, the component holder that holds a component is configured to include a pair of grip members that pinch and grip the component, a grip member opening/closing portion that opens and closes the pair of grip members with an opening/closing motor as a drive source, a pair of contact portions that are disposed on the pair of grip members and freely rotate around a rotary shaft provided in an opening/closing direction of the grip member, and a contact portion driving portion that causes a roller, which is provided to be in contact with a side of a nozzle shaft, to convert a lifting and lowering motion of a nozzle shaft into a rotational motion of a spline shaft, and that causes the rotational motion to be transmitted to the contact portion via a plurality of rollers such that the contact portion rotates around the rotary shaft.

A component supply device including a main body provided with an introducing region into which a component supply tape holding components is introduced and configured to supply the components by sending the component supply tape introduced into the main body via the introducing region in a longitudinal direction of the component supply tape. The device comprises a tape supporter insertable into the introducing region while supporting the component supply tape, and a clamping mechanism configured to sandwich and hold at least a part of a supported part of the component supply tape supported by the tape supporter with respect to the tape supporter. The component supply tape is introduced into the main body by inserting the tape supporter into the introducing region with the component supply tape held by the clamping mechanism.

A die stack having a second die is stacked vertically on top of a first die. A first plurality of test pads is located along a first edge of the first die. A second plurality of test pads is located along a second edge of the first die. The first edge of the first die is parallel to the second edge of the first die. A third plurality of test pads is located along a first edge of the second die. A fourth plurality of test pads is located along a second edge of the second die. The first edge of the second die is parallel to the second edge of the second die. The first edge of the first die and the second edge of the first die are perpendicular to the first edge of the second die and the second edge of the second die.

A control device is configured as an information processing apparatus which is used for a mounting apparatus for mounting a component on a board. The control device acquires an image, including at least a reference portion in a state where a component is gripped by a component gripper having a positioning grip portion that grips the component in a positioned state, and having the reference portion that represents a reference position serving as a predetermined relative position to the position of the component gripped by the positioning grip portion, acquires a position of the reference portion based on the acquired image, and acquires a position of the component based on the relative position to the acquired position of the reference portion.