Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

A position and orientation of an electronic component attitude are recognized, a mounting head is moved above the electronic component, a rotator is horizontally rotated so that a lower surface of the electronic component is oriented in a direction opposite to a pusher, the electronic component of the fallen-down attitude is sucked and held by the nozzle by lowering a component holder, a attitude of the electronic component that is held is changed to a stand-up attitude by vertically rotating the component holder, leads of the electronic component of which the attitude is changed to the stand-up attitude and insertion holes of the substrate into which the leads are inserted are positioned, and the leads are inserted into the insertion holes of the substrate by pushing the electronic component toward the substrate by causing the pusher to abut against an upper surface of the electronic component of the stand-up attitude.

Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.

A component mounting device configured to mount an axial component on a substrate, comprising: a movable forming-die; a fixed forming-die; a mounting head; and a distance adjustment portion, wherein the distance adjustment portion makes an adjustment such that when the movable forming-die delivers the axial component to the mounting head the distance between the claws is larger than a distance of the fixed forming-die.

A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.

Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

Provided is a method for mounting an electronic component having a plurality of board insert type leads on a board. The method includes a holding process which chucks one of the plurality of leads of the electronic component to hold the electronic component, and an inserting process which inserts the leads of the electronic component held by the mounting head respectively into lead insert holes provided in the board.

The present invention relates to a method for producing a microphone unit, which can be contacted by a plug connector, and a microphone unit, wherein this comprises a housing, a circuit board having a microphone component and contacts, wherein the contacts are embodied on second contact ends as contact pins and wherein the contacts are connected at the first contact ends to the circuit board, wherein a multi-pole plug connector can be connected to the contact pins. The housing is embodied as a one-part injection molded part and the first contact ends are embodied as pressfit contacts.