B05B1/005

EQUIPMENT FOR TREATING SUBSTRATE AND TREATMENT SOLUTION DEGASSING METHOD
20230201844 · 2023-06-29 · ·

Provided is an equipment for treating a substrate. The substrate treating equipment may include: a nozzle supplying a chemical solution to a substrate; and a chemical solution supply apparatus supplying the chemical solution to the nozzle, and the chemical solution supply apparatus may include a pump member, an extraction nozzle provided on a flow path through which the chemical solution is introduced into the pump member and spraying the chemical solution by a spray scheme, and a control unit controlling an operation of the pump member.

SYSTEMS, LANCES, NOZZLES, AND METHODS FOR POWDER INJECTION RESULTING IN REDUCED AGGLOMERATION
20170361340 · 2017-12-21 · ·

A lance for powder injection resulting in reduced agglomeration, including an outer tubular member having a first end, a second end, and an inner flowpath extending from the first end to the second end; an inner tubular member having a first end, a second end, and a, inner flowpath extending from the first end to the second end, the inner tubular member disposed within the inner flowpath of the outer tubular member for providing an annular space between the outer tubular member and the inner tubular member; and one or more orifices in the inner tubular member for providing a flowpath between the annular space and the inner flowpath of the inner tubular member. Additional lances, systems, and methods are also included.

RUN-THROUGH CLEANING DEVICE AND CLEANING METHOD THEREFOR
20170361358 · 2017-12-21 ·

A run-through cleaning device for bulk parts as well as a cleaning method therefor. Within the run-through cleaning device, the bulk parts are moved by means of a forced advance. By means of chicanes and/or a curvilinear course of the channel interior, the mutually abutting front ends of adjacent bulk parts are made accessible. Due to this arrangement, it is possible to also clean the front ends.

System for effecting an exothermic reaction in a nozzle to drive a phase change from a liquid to a gas
20170361339 · 2017-12-21 ·

A device is described herein for priming and stimulating a fluid that enters a nozzle such that when the fluid experiences a phase change from liquid to gas, said phase change releases energy latent within molecules or atoms of any of the interior surface of the nozzle and the fluid, producing an energy release, thereby enabling that phase-changed gas to be used to generate energy using well-known techniques in the prior art.

Metering valve and jet pump unit for controlling a gaseous medium

The invention relates to a metering valve (1) for controlling a gaseous medium, in particular hydrogen, comprising a valve housing (2), wherein an interior space (3) is formed in the valve housing (2). A reciprocating closing element (10) is arranged in the interior space (3), which interacts with a valve seat (37) for opening or closing at least one passage channel (25). Furthermore, the metering valve (1) comprises a nozzle (11), the at least one passage channel (25) being formed in the nozzle (11) and the passage channel (25) having a circular-cylindrical portion.

MOTION GUIDE APPARATUS COOLING NOZZLES, MOTION GUIDE APPARATUS WITH COOLING NOZZLES, AND MOTION GUIDE APPARATUS COOLING SYSTEM

A motion guide apparatus cooling nozzle is provided which can gas-cool a motion guide apparatus. Cooling nozzles 1a and 1b of the present invention are mounted on a block 4 of the motion guide apparatus to cool at least one of a guide rail 2 and a block 4 that is assembled to the guide rail 2 via a rolling element 6 in such a manner as to be movable relatively. The cooling nozzles la and 1b include an inner passage 18 into which gas is introduced, an opening 12a configured to emit a gas flow introduced into the inner passage 18, a deflection surface 22a that is provided adjacently to the opening 12a to bend the gas flow emitted from the opening 12a, and a guiding surface 32a configured to attract gas outside the cooling nozzles 1a and 1b.

Apparatus for Spraying Cryogenic Fluids
20170341093 · 2017-11-30 ·

Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. In particular, an improved nozzle design used to expand the fluid mixture is disclosed herein. In one embodiment, the nozzle design incorporates a two nozzle pieces are combined to form a single nozzle design, in which the two pieces are slight misaligned to form a unique orifice design. In another embodiment, two pieces are combined and aligned along a common axis of the fluid conduit. However, an offset piece is inserted between the two pieces and has a hole that misaligned from the flow conduits of the two other pieces.

Nozzle assembly capable of performing suction and high pressure blowing
09827576 · 2017-11-28 · ·

A nozzle assembly comprises an intake section, an inner ring section, a discharging section, an intake screw rod, and two blocking caps. The intake section, the inner ring section and the discharging section are joined to each other to be turned with respect to the intake screw rod and secured to the first position to admit large air flow passing through, and to the second position 180 degrees apart from the first position to perform suction with discharge. One of the blocking caps covers the flow hole of the intake section and another blocking cap covers the discharge bore of the discharging section and is provided with a spray pipe to perform high pressure blowing.

SPRAY COATING APPARATUSES WITH TURN NOZZLE ASSEMBLIES AND METHODS OF COATING GLASS OBJECTS

A spray coating apparatus that applies a coating material onto outer surfaces of glass objects includes a coating material source that includes a coating material. A spray nozzle assembly includes a spray nozzle fluidly connected to the coating material source. The spray nozzle is arranged and configured to direct the coating material in a first direction toward the glass object and provide an overspray amount of the coating material by the glass object such that the overspray amount bypasses a non-line of sight area of the glass object. A turn nozzle assembly includes a turn nozzle fluidly connected to a pressurized gas source. The turn nozzle is arranged and configured to direct pressurized gas in a second direction different than the first direction toward the non-line of sight area of the glass package to redirect the coating material onto the non-line of sight area.

Chemical control features in wafer process equipment

Gas distribution assemblies are described including an annular body, an upper plate, and a lower plate. The upper plate may define a first plurality of apertures, and the lower plate may define a second and third plurality of apertures. The upper and lower plates may be coupled with one another and the annular body such that the first and second apertures produce channels through the gas distribution assemblies, and a volume is defined between the upper and lower plates.