A manufacturing method for manufacturing a fuel cell includes a laser application step and a bonding step. In the laser application step, a laser beam is applied to a carbon film of a separator including a metal plate and the carbon film covering a surface of the metal plate such that the metal plate is exposed by removing the carbon film within an application range of the laser beam. In the bonding step, the separator is bonded to a resin member within a range including at least part of a range where the metal plate is exposed.

A display device includes: a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate facing the first substrate; and a cell seal disposed on the non-display area, where the cell seal includes a bonding filament connecting the first substrate and the second substrate to each other.

A laser welding system for sealing welding a cell top cover includes a laser emitting device for generating a scanning welding laser beam to be irradiated to a portion of the cell top cover to be welded, and a control device for controlling the laser emitting device to perform continuous scanning sealing welding on the cell top cover. The laser welding system is configured to complete the sealing welding of the cell top cover at only one work station.

A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

The present invention relates to a turntable-type probe pin laser bonding apparatus wherein a pin gripper mounted on four surfaces automatically laser-bonds a probe pin to a probe card while continuously rotating pin grippers in a turntable method. More particularly, the present invention relates to a multi-axis gripper unit of a turntable type probe pin laser bonding apparatus that can continuously process the pickup, dipping, and laser bonding of probe pins while freely moving linearly or rotationally in multi-axis directions, for example, the X-axis, Y-axis, Xθ-axis, Yθ-axis, and the gripper axis, with high precision in micrometer units by being applied to the laser bonding unit.

The present invention relates to a turntable-type probe pin laser bonding apparatus wherein a pin gripper mounted on four surfaces automatically laser-bonds a probe pin to a probe card while continuously rotating pin grippers in a turntable method. More particularly, the present invention relates to a multi-axis gripper unit of a turntable type probe pin laser bonding apparatus that can continuously process the pickup, dipping, and laser bonding of probe pins while freely moving linearly or rotationally in multi-axis directions, for example, the X-axis, Y-axis, Xθ-axis, Yθ-axis, and the gripper axis, with high precision in micrometer units by being applied to the laser bonding unit.

A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature.

A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

An energy storage device is equipped with a container having a container body and a lid body, which closes an opening of the container body. An elongated welded part which is a welded portion between the container body and the lid body, is formed on the container. The welded part has a first welded part and a second welded part arranged in a row in a lengthwise direction of the welded part, wherein a width of the second welded part in a widthwise direction of the welded part is set larger than a width of the first welded part in the widthwise direction. A gas release vent is disposed on the lid body, wherein the second welded part is disposed on a lateral side of the gas release vent, and a length of the second welded part in the lengthwise direction is set larger than a length of the gas release vent in the lengthwise direction.

A substrate stack includes: at least two substrates including a base substrate and a cover substrate; at least one first laser weld line for welding the base substrate and the cover substrate; and at least one second beam spot or at least one second laser weld line at least one of situated next to the at least one first laser weld line or positioned such that a stress reduction in the at least one first laser weld line is achieved by the at least one second beam spot or second laser weld line, thus improving the mechanical stability of the substrate stack.