An imaging device capable of suppressing deterioration in electrical characteristics and improving layout efficiency is provided. The imaging device includes a semiconductor layer and a plurality of pixels provided in the semiconductor layer. Each of the plurality of pixels includes a photoelectric conversion unit, a floating diffusion that converts a charge generated by the photoelectric conversion unit into a voltage signal, and a transfer transistor that transfers the charge generated in the photoelectric conversion unit to the floating diffusion. In one pixel and the other pixel that are adjacent to each other among the plurality of pixels, one or more of the photoelectric conversion unit, the floating diffusion, and the transfer transistor are arranged non-linearly symmetrically and point-symmetrically.

An image sensing device may include one or more pixel groups arranged in rows and columns in an array, each pixel group being arranged at an intersection between a row and a column of the array, wherein each pixel group comprises one or more floating diffusion regions, and one or more groups of an odd number photoelectric conversion units structured to convert incident light to generate electrical charge, each group of the odd number of photoelectric conversion units electrically connected in common to one of the floating diffusion regions for receiving the generated electrical charge.

An image sensor includes a first substrate. A photoelectric conversion region is in the first substrate. A first interlayer insulating layer is on the first substrate. A transistor includes a bonding insulating layer on the first interlayer insulating layer, a semiconductor layer on the bonding insulating layer, and a first gate on the semiconductor layer. A bias pad is spaced apart from the semiconductor layer by the bonding insulating layer. The bias pad overlaps the first gate in a planar view. A second interlayer insulating layer covers the transistor.

The present description concerns a pixel array comprising one or a plurality of pixels (PIX1). Each pixel comprises a first transistor having its control node coupled to a photodiode, a first main conduction node coupled to a first output voltage rail (VS), and a second main conduction node coupled to a second voltage rail (VCS). The array comprises a variable impedance (404) coupling the first voltage rail (VS) to a first power supply rail (VDD) and a current source (402) coupling the second voltage rail (VCS) to a second power supply rail (GND), the variable impedance (404) being controlled based on a voltage on the second voltage rail (VCS). The array comprises a first switch (4002) coupling the second voltage rail (VCS) to a third voltage rail (VINIT1).

Some embodiments relate to an imaging system including an active pixel a comparator, a write control circuit, and an analog-to-digital conversion (ADC) memory. The active pixel may include a photodiode and a plurality of transistors. The comparator may be operative coupled to the active pixel and configured to receive an output of the active pixel. The write control circuit may be operative coupled to the comparator and configured to receive an output from the comparator. The ADC memory may be operatively coupled to the write control circuit. A data structure may be stored in the ADC memory, and may be configured to store at least a first data string, which may include a set of flag bits for identifying each ADC operation performed and a set of ADC data bits.

An X-ray device including a sensing panel and a scintillator layer is provided. The sensing panel includes a substrate and a first pixel. The first pixel is disposed on the substrate and includes a first light sensing component and a first switch component. The first switch component is disposed on the first light sensing component. The scintillator layer is disposed on the sensing panel, and the first switch component is disposed between the scintillator layer and the first light sensing component.

The present disclosure relates to a solid-state imaging device, a method for driving the solid-state imaging device, and an electronic device capable of improving auto-focusing accuracy by using a phase difference signal obtained by using a photoelectric conversion film. The solid-state imaging device includes a pixel including a photoelectric conversion portion having a structure where a photoelectric conversion film is interposed by an upper electrode on the photoelectric conversion film and a lower electrode under the photoelectric conversion film. The upper electrode is divided into a first upper electrode and a second upper electrode. The present disclosure can be applied to, for example, a solid-state imaging device or the like.

An optical sensor includes a substrate, a photoelectric element disposed on the substrate and that includes a first electrode, an intermediate layer disposed on the first electrode, and a second electrode disposed on the intermediate layer, a barrier layer disposed on the second electrode, an insulating layer that covers the photoelectric element and the barrier layer, and a bias electrode disposed on the insulating layer and electrically connected to the second electrode. The barrier layer is spaced apart from the first electrode.

A diode array with at least two image elements. The diode array includes a distribution transistor as well as a feed line for receiving a reference current and a first supply terminal coupled to the distribution transistor for supplying the distribution transistor. A diode and an input transistor are provided for each image element, each of which is coupled to the diode for supplying the diode. The distribution transistor forms a distribution current mirror with the respective input transistor of at least two image elements.

Disclosed are an image sensor and an image sensing method. The image sensor includes a first pixel circuit. The first pixel circuit includes a first driving transistor, a first selection transistor, a first transfer transistor, a first reset transistor and a first sensing unit. A control terminal of the first selection transistor is used for receiving a first selection signal. A control terminal of the first transmitting transistor is used for receiving a first transmitting signal. The image sensing method includes the following steps: receiving a first reset signal during a reset period through a control terminal of the first reset transistor; and receiving a first ramp signal during a sensing period through a control terminal of the first reset transistor.