Non-volatile memory including rows and columns of memory cells, the columns of memory cells including pairs of twin memory cells including a common selection gate. According to the disclosure, two bitlines are provided per column of memory cells. The adjacent twin memory cells of the same column are not connected to the same bitline while the adjacent non-twin memory cells of the same column are connected to the same bitline.

The disclosure belongs to the technical field of semiconductor power devices, specifically relates to a semi-floating-gate power device, and comprises the gallium nitride high-electron-mobility transistor, the diode and the capacitor; the anode of the diode is connected with the gate of the gallium nitride high-electron-mobility transistor and the cathode of the diode is connected with the source or the channel area of the gallium nitride high-electron-mobility transistor; one end of the capacitor is connected with the gate of the gallium nitride high-electron-mobility transistor and the other end of the capacitor is connected with the external voltage signal. The semi-floating-gate power device has a simple structure, is easy to manufacture, adapts to high-voltage and high-speed operation and has very high reliability, can increase the threshold voltage of the gallium nitride high-electron-mobility transistor in the working state, so that the transistor can serve as the power switch tube better.

An irreproducible and re-emergent unique structure or pattern identifier manufacturing and detection method, system, and apparatus is provided. A non-volatile floating gate charge storage device can include a block of floating gate transistors that can include a semiconductor region, a source region, a drain region, a floating gate region, a tunnel oxide region, an oxide-nitrite-oxide region, and a control gate region. A structure altering stress effect is applied to the block of transistors to create a passage region in a random number of floating gate regions of floating gate transistors which changes charge storage or electrical characteristics of random elements of the block of transistors. The passage region alters charges on a floating gate region to escape in a different manner than pre-alteration form causing the floating gate region to lose its charge. An apparatus for recording and detecting such differences in pre and post alteration can also be provided.

Methods of fabricating a memory cell of a semiconductor device, e.g., an EEPROM cell, having a sidewall oxide are disclosed. A memory cell structure may be formed including a floating gate and an ONO film over the conductive layer. A sidewall oxide may be formed on a side surface of the floating gate by a process including depositing a thin high temperature oxide (HTO) film on the side surface of the conductive layer, and performing a rapid thermal oxidation (RTO) anneal. The thin HTO film may be deposited before or after performing the RTO anneal. The sidewall oxide formation process may provide an improved memory cell as compared with known prior art techniques, e.g., in terms of endurance and data retention.

Various embodiments include apparatuses and methods of forming the same. One such apparatus can include a first dielectric material and a second dielectric material, and a conductive material between the first dielectric material and the second dielectric material. A charge storage element, such as a floating gate or charge trap, is between the first dielectric material and the second dielectric material and adjacent to the conductive material. The charge storage element has a first surface and a second surface. The first and second surfaces are substantially separated from the first dielectric material and the second dielectric material, respectively, by a first air gap and a second air gap. Additional apparatuses and methods are disclosed.

A semiconductor nonvolatile memory element is used to form a constant current source in a semiconductor integrated circuit device. The semiconductor nonvolatile memory element includes a control gate electrode, a floating gate electrode, source/drain terminals, a thin first gate insulating film, and a second gate insulating film that is thick enough not to be broken down even when a voltage higher than an operating voltage of the semiconductor integrated circuit device is applied thereto, the first and second gate insulating films being formed below the control gate electrode. Thus, provided is a normally on type semiconductor nonvolatile memory element in which a threshold voltage can be regulated through injection of a large amount of charge with respect to the operating voltage from a drain terminal into the floating gate electrode via the second gate insulating film, and injected carriers do not leak in an operating voltage range.

A method (and system) for generating random numbers includes setting a drain voltage Vd on an MOSFET device to maximize a transconductance of the MOSFET device and setting a gate voltage Vg of the MOSFET device to tune as desired a random number statistical distribution of an output of the MOSFET device> The MOSFET device includes a gate structure with an oxide layer including at least one artificial trapping layer in which carrier traps are designed to occupy a predetermined distance from conduction and valance bands of material of the artificial trapping layer.

A device comprises a nanowire over a substrate, wherein the nanowire comprises a first drain/source region over the substrate, a channel region over the first drain/source region and a second drain/source region over the channel region, a high-k dielectric layer and a control gate layer surrounding a lower portion of the channel region and a tunneling layer and a ring-shaped floating gate layer surrounding an upper portion of the channel region.

Provided is a floating gate based 3-terminal analog synapse device including a silicon channel layer; a gate oxide deposited on the silicon channel layer; a charge trap layer deposited on the gate oxide, wherein charges are injected into the charge trap layer; a barrier layer deposited on the charge trap layer, and having lower electron affinity than electron affinity of a material of the charge trap layer; and a gate metal layer deposited on an upper surface of the barrier layer, wherein a gate voltage is applied to the gate metal layer.

A four transistor ternary content-addressable memory cell includes a first series connection of a first non-hysteretic transistor (e.g., a thin-film transistor) and a first memory transistor (e.g., a thin-film transistor) including a first memory element configured to store a first binary bit; and a second series connection of a second non-hysteretic transistor and a second memory transistor including a second memory element configured to store a second binary bit. The first series connection and the second series connection are connected in parallel between a match line and a word line.