The present invention provides a GOA circuit structure for a slim-bezel LCD, including: a latch, a NAND gate, a buffer unit, and a reset unit. An input signal is supplied to the latch and an output signal is supplied from the buffer unit. The buffer unit includes a plurality of TFTs formed of a first metal layer (1), a second metal layer (2), and an active layer (3) arranged between the first metal layer (1) and the second metal layer (2). Each of the TFTs includes a dual-gate arrangement including a bottom gate formed of the first metal layer (1), a source and a drain formed of the second metal layer (2), and a top gate also formed of the second metal layer (2) so that the size of the TFT of the buffer unit can be reduced, the width of buffer unit can be reduced, thereby reducing the width of the GOA circuit and allowing a bezel of the LCD to be slimmer.

A display device includes a display panel, a gate driving circuit, and an image determination unit. The gate driving circuit includes a double gate transistor. The image determination unit outputs an image determination signal to a second control electrode of the double gate transistor. When the display panel displays a still image, the double gate transistor is turned on by the image determination signal so that each of gate signals outputted from stages connected in cascade to a stage including the double gate transistor among stages included in the gate driving circuit has a gate-off voltage.

The present invention provides a method for manufacturing the N-type TFT, which includes subjecting a light shielding layer to a grating like patternization treatment for controlling different zones of a poly-silicon layer to induce difference of crystallization so as to have different zones of the poly-silicon layer forming crystalline grains having different sizes, whereby through just one operation of ion doping, different zones of the poly-silicon layer have differences in electrical resistivity due to difference of grain size generated under the condition of identical doping concentration to provide an effect equivalent to an LDD structure for providing the TFT with a relatively low leakage current and improved reliability. Further, since only one operation of ion injection is involved, the manufacturing time and manufacturing cost can be saved, damages of the poly-silicon layer can be reduced, the activation time can be shortened, thereby facilitating the manufacture of flexible display devices.

The present invention provides a TFT substrate structure, comprising a Switching TFT and a Driving TFT, and the Switching TFT comprises a first active layer, and the Driving TFT comprises a second active layer, and the first active layer and the second active layer are made by the same or different materials and the electrical properties of the Switching TFT and the Driving TFT are different. According to the different functions of the different TFTs, the present invention employs different working structures for the Switching TFT and the Driving TFT to respectively implement deposition and photolithography, and employs different materials for the active layers of the Switching TFT and the Driving TFT to differentiate the electrical properties of different TFTs in the TFT substrate. Accordingly, the accurate control to the OLED with lowest cost can be realized.

An LCD panel, an array substrate and a manufacturing method for TFT are disclosed. The method includes: providing a substrate; forming a first metal layer on the substrate, wherein the first metal layer includes an aluminum metal layer, an aluminum oxide layer and a molybdenum metal layer stacked sequentially; patterning the first metal layer to form a gate electrode of a TFT; sequentially forming a gate insulation layer, a semiconductor layer and an ohmic contact layer on the gate electrode; forming a second metal layer on the ohmic contact layer; and patterning the second metal layer to form a source electrode and a drain electrode of the TFT. The present invention can inhibit hillock generated by the aluminum metal layer in a high temperature environment, avoid the short circuit generated among the gate, the source and the drain electrodes of the TFT to ensure the display quality of an image.

A thin film transistor (TFT) device is provided. The TFT device includes a first conductive layer including a gate electrode and a connection pad. The TFT device further includes a first dielectric layer covering the gate electrode, and a semiconductor layer disposed on the dielectric layer and overlapping the gate electrode. The TFT device further includes a second dielectric layer disposed on the semiconductor layer and the first dielectric layer so as to expose first and second portions of the semiconductor layer and the connection pad. The TFT device further includes a second conductive layer which includes a source electrode portion covering the first portion of the semiconductor layer; a pixel electrode portion extending to the source electrode portion; a drain electrode portion covering the second portion of the semiconductor layer; and an interconnection portion disposed on the connection pad and extending to the drain electrode portion.

With an image sensor in which the amplifier circuit is disposed at each pixel, there is such an issue that the threshold voltage of the transistor fluctuates so that the signal voltage fluctuates because a voltage is continuously applied between the source and the gate of the transistor at all times when using the amorphous thin film semiconductor as the transistor that constitutes an amplifier circuit. The gate-source potential of the TFT that constitutes the amplifier circuit is controlled so that the gate terminal voltage becomes smaller than the source terminal voltage in an integrating period where the pixels accumulate the signals, and controlled so that the gate terminal voltage becomes larger than the source terminal voltage in a readout period where the pixels output the signals.

A TFT and manufacturing method thereof, an array substrate and manufacturing method thereof, an X-ray detector and a display device are disclosed. The manufacturing method includes: forming a gate-insulating-layer thin film (3), a semiconductor-layer thin film (4) and a passivation-shielding-layer thin film (5) successively; forming a pattern (5) that includes a passivation shielding layer through one patterning process, so that a portion, sheltered by the passivation shielding layer, of the semiconductor-layer thin film forms a pattern of an active layer (4a); and performing an ion doping process to a portion, not sheltered by the passivation shielding layer, of the semiconductor-layer thin film to form a pattern comprising a source electrode (4c) and a drain electrode (4b). The source electrode (4c) and the drain electrode (4b) are disposed on two sides of the active layer (4a) respectively and in a same layer as the active layer (4a). The manufacturing method can reduce the number of patterning processes and improve the performance of the thin film transistor in the array substrate.

The disclosure provides a manufacturing method for TFT array substrate, a TFT array substrate and a display device. The manufacturing method includes following steps: in sequence, forming a gate pattern layer, a gate insulating layer, a patterned poly-silicon layer, a separation layer on s substrate, and adopting a mask to form a source pattern layer and a drain pattern layer on the separation layer by photolithography processes. The source pattern layer and the drain pattern layer are connected to the patterned poly-silicon layer. The mask blocks one side of the channel area, and the same mask is adopted to form a lightly doped area on the other side of the channel area not blocked by the mask. The disclosure may reduce production costs and has great design flexibility.

The present invention provides a method for manufacturing the N-type TFT, which includes subjecting a light shielding layer to a grating like patternization treatment for controlling different zones of a poly-silicon layer to induce difference of crystallization so as to have different zones of the poly-silicon layer forming crystalline grains having different sizes, whereby through just one operation of ion doping, different zones of the poly-silicon layer have differences in electrical resistivity due to difference of grain size generated under the condition of identical doping concentration to provide an effect equivalent to an LDD structure for providing the TFT with a relatively low leakage current and improved reliability. Further, since only one operation of ion injection is involved, the manufacturing time and manufacturing cost can be saved, damages of the poly-silicon layer can be reduced, the activation time can be shortened, thereby facilitating the manufacture of flexible display devices.