A device includes: a substrate; a first superconductor layer on the substrate, the first superconductor layer having a first kinetic inductance; and a second superconductor layer on the first superconductor layer, the second superconductor layer having a second kinetic inductance that is lower than the first kinetic inductance, in which the second superconductor layer covers the first superconductor layer such that the second superconductor layer and the first superconductor layer have a same footprint, with the exception of at least a first region where the second superconductor layer is omitted so that the first superconductor layer and the second superconductor layer form a circuit element having a predetermined circuit parameter.

Provided is an ultrasonic sensor including a piezoelectric elements arranged along a first direction and a second direction on a vibration plate, an insulation layer, and conductive lines. Each piezoelectric element including a first electrode, a piezoelectric layer, and a second electrode. The first electrode is partially removed in a regions between the piezoelectric elements. The second electrode is a separate electrode provided for each piezoelectric element. The insulation layer covers the second electrodes and has holes through which portions at opposite ends of the second electrodes along the first direction are partially exposed. Each conductive line is provided between adjacent ones of the second electrodes along the first direction and electrically connects, via the holes, the adjacent ones of the second electrodes.

An integrated circuit is provided that comprises a first substrate having a plurality of conductive contact pads spaced apart from one another on a surface of the first substrate, a dielectric layer overlying the first substrate and the plurality of conductive contact pads, and a second substrate overlying the dielectric layer. A plurality of superconducting contacts extend through the second substrate and the dielectric layer to the first substrate, wherein each superconducting contact of the plurality of superconducting contacts is aligned with and in contact with a respective conductive contact pad of the plurality of conductive contact pads.

An electronic device (e.g., a superconducting memory cell) includes a substrate and a layer of superconducting material disposed over the substrate. The layer of superconducting material is patterned to form a plurality of distinct instances of the layer of superconducting material including: a first wire; and a loop that is (i) distinct and separate from the first wire and (ii) capacitively coupled to the first wire while the loop and the first wire are in a superconducting state. The loop is configured to form a persistent current via the capacitive coupling in response to a write current applied to the first wire while the loop and the first wire are in the superconducting state. The persistent current represents a logic state of the electronic device.

An approach is provided for adiabatic quantum annealing (computing, AQC). There is disclosed an apparatus comprising a first quantum dot and a second quantum dot forming a first kind of double quantum dot; and a third quantum dot and a fourth quantum dot forming a second kind of double quantum dot. The apparatus also comprises a first control element for adjusting a capacitance of a capacitive element; a second control element for supplying a control voltage to the first kind of double quantum dot; a metallic or superconducting contact to capacitively couple the first kind of double quantum dot to the fourth quantum dot; and an electric charge sensor for providing an indication of the state of the first kind of double quantum dot. The present invention also relates to a method for controlling the apparatus.

A method of multiplexing control lines of a qubit array includes applying a qubit control signal to a single driveline. The qubit control signal is split on the single driveline between a first resonator and a second resonator. The first driveline is operative to control a first qubit, a second tunable qubit, a third qubit, and a fourth tunable qubit. The first qubit is coupled to the second tunable qubit by the first resonator. The third qubit is coupled to the fourth tunable qubit by the second resonator. A variation in amplitude of the qubit control signal is compensated by adjusting a frequency of the second tunable qubit and a frequency of the fourth tunable qubit.

A method for increasing the integration level of superconducting electronic circuits, comprising fabricating a series of planarized electrically conductive layers patterned into wiring, separated by planarized insulating layers, with vias communicating between the conductive layers. Contrary to the standard sequence of patterning from the bottom up, the pattern of vias in at least one insulating layer is formed prior to the pattern of wiring in the underlying conductive layer. This enables a reduction in the number of planarization steps, leading to a fabrication process which is faster and more reliable. In a preferred embodiment, the superconductor is niobium and the insulator is silicon dioxide. This method can provide 10 or more wiring layers in a complex integrated circuit, and is compatible with non-planarized circuits placed above the planarized wiring layers.

A parametric traveling wave amplifier (200) is disclosed in which the amplifiers include: a co-planar waveguide, in which the co-planar waveguide includes at least one Josephson junction (210) interrupting a center trace (204) of the co-planar waveguide; and at least one shunt capacitor coupled to the co-planar waveguide, in which each shunt capacitor of the at least one shunt capacitor includes a corresponding superconductor trace (214) extending over an upper surface of the center trace of the co-planar waveguide, and in which a gap separates the superconductor trace from the upper surface of the center trace, and in which the co-planar waveguide including the at least one Josephson junction and the shunt capacitor establish a predefined overall impedance for the traveling wave parametric amplifier.

A method for manufacturing a superconducting LC-type resonator of the type including at least one high-resistivity substrate on which are printed an inductive meander, a first so-called lower electrode and a second so-called upper electrode arranged opposite the first so as to form together a capacitor connected in parallel with the inductive meander, as well as inductive coupling means dedicated to the resonator, in which a sacrificial aluminium layer is deposited between the first and second electrodes. Also disclosed is the superconducting LC-type resonator thus obtained and the use of such a resonator for detecting the noise of a millimetre photon.

A quantum system includes a qubit array comprising a plurality of qubits. A bus resonator is coupled between at least one pair of qubits in the qubit array. A switch is coupled between the at least one qubit pair of qubits.