A microfluidic bead-packing method includes activating a first micropump to transfer active microbeads through an inlet microchannel from a bead suspension reservoir to an adsorbing channel; packing the microbeads in the adsorbing channel; and activating a second micropump to reverse flow through at least a portion of the inlet microchannel and to transfer a sample fluid through the inlet microchannel from a sample reservoir to the adsorbing channel such that the sample fluid interacts with the packed microbeads.

The invention concerns the production of segmented nanowires and components having said segmented nanowires. For the production of the nanowire structural element, a template based process is used preferably, wherein the electrochemical deposition of the nanowires in nanopores is carried out. In this manner, numerous nanowires are created in the template foil. For the electrochemical deposition of the nanowires, a reversed pulse procedure with an alternating sequence consisting of cathodic deposition pulses and anodic counter-pulses is carried out. By this means, segmented nanowires can be produced.

According to embodiments of the present invention, a microfluidic chip, a manufacturing method therefor and an analysis device using the same are provided. The microfluidic chip comprises: a substrate comprising an inflow part through which a fluid flows in, a fluid channel through which the fluid moves and an outflow part through which the fluid flows out; and a film attached to the substrate to protect at least one of the inflow part, the outflow part and the fluid channel from the outside, wherein the inflow part and the outflow part are implemented by penetrating through the surface of the substrate, and the fluid channel can be implemented by being sunk from the surface of the substrate.

The invention is directed to a microfluidic device, which comprises distinct, parallel levels, including a first level and a second level. It further includes: a first microchannel, a second microchannel, and a node. This node comprises: an inlet port, a cavity, a via, and an outlet port. The cavity is formed on the first level and is open on a top side. The inlet port is defined on the first level; it branches from the first microchannel and communicates with the cavity through an ingress thereof. The outlet port, branches to the second microchannel on the second level. The via extends from the bottom side of the cavity, down to the outlet port, so the cavity may communicate with the outlet port. In addition, the cavity comprises a liquid blocking element to prevent an aqueous liquid filling the inlet port to reach the outlet port.

A microfluidic device includes first and second outer layers each having one or more microfluidic formations and an intermediate layer bonded between the first and second outer layers; in which the glass transition temperature of the first outer layer is higher than the glass transition temperature of the second outer layer.

Microfluidics has advanced in terms of designs and structures, however, fabrication methods are either time consuming or expensive to produce, in terms of the facilities and equipment needed. A fast and economically viable method is provided to allow, for example, research groups to have access to microfluidic fabrication. Unlike most fabrication methods, a method is provided to fabricate a microfluidic device in one step. In an embodiment, a resolution of 50 micrometers was achieved by using maskless high-resolution digital light projection (MDLP). Bonding and channel fabrication of complex or simple structures can be rapidly incorporated to fabricate the microfluidic devices.

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

A microfluidic device includes a semiconductor chip having a main chip surface. The microfluidic device further includes an encapsulation body embedding the semiconductor chip, the encapsulation body having a main body surface. A microfluidic component extends over the main chip surface and over the main encapsulation body surface and traverses an outline of the main chip surface.

An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.

A three-dimensional (3D) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.