A MEMS sensor includes: a conductive device-side substrate including cavity in thickness direction thereof; a MEMS electrode arranged in the cavity; a support extending in first direction toward the MEMS electrode from peripheral wall of the cavity and connected to and support the MEMS electrode; and an isolator traversing the support in second direction in plan view to isolate the support into a first support on the side of the MEMS electrode and a second support on the side of the device-side substrate to be electrically insulated from each other in the first direction, wherein the isolator includes: a trench recessed in the thickness direction with respect to the device-side substrate; insulating layers formed on inner wall surfaces of the trench; and joining layers formed on the insulating layers and including portions facing each other and at least partially joined to each other in the first direction.

An apparatus includes a substrate having at least one via disposed in the substrate, wherein the substrate includes a trench having a substantially trapezoidal cross-section, the trench extending through the substrate between a lower surface of the substrate and an upper surface of the substrate, wherein the top of the trench opens to a top opening, and the bottom of the trench opens to a bottom opening, the top opening being larger than the bottom opening. The apparatus can include a mouth surrounding the top opening and extending between the upper surface and the top opening, wherein a mouth opening in the upper surface is larger than the top opening of the trench, wherein the via includes a dielectric layer disposed on an inside surface of a trench. The apparatus includes and a disposed in the trench, with the dielectric layer sandwiched between the fill and the substrate.

An actuator for moving a platform having electrical connections is provided. The actuator includes an outer frame connected to an inner frame by one or more spring elements that are electrically conductive. The actuator further includes one or more comb drive actuators that apply a controlled force between the outer frame and the inner frame. Each of the comb drive actuators includes one or more comb drives. Moreover, a method for moving a platform having electrical connections is also provided. The method includes connecting an outer frame to an inner frame using one or more spring elements that are electrically conductive. The method further includes generating a controlled force using one or more comb drive actuators. Each of the comb drive actuators includes one or more comb drives. In addition, the method includes applying the controlled force between the outer frame and the inner frame.

According to an embodiment, a method of forming a MEMS transducer includes forming a transducer frame in a layer of monocrystalline silicon, where forming the transducer frame includes forming a support portion adjacent a cavity and forming a first set of comb-fingers extending from the support portion. The method of forming a MEMS transducer further includes forming a spring support from an anchor to the support portion and forming a second set of comb-fingers in the layer of monocrystalline silicon. The second set of comb-fingers is interdigitated with the first set of comb-fingers.

[Object] To be capable of promptly performing a switching operation of a switch.

[Solving Means] In a switching apparatus according to an embodiment of the present technology, a movable electrode includes a first movable electrode piece, a second movable electrode piece, and a movable contact point. A first fixed electrode includes first and second fixed electrode pieces, the first and second fixed electrode pieces facing each other with the first movable electrode piece disposed between the first and second fixed electrode pieces, the first fixed electrode piece facing the first movable electrode piece with a gap narrower than a gap between the second fixed electrode piece and the first movable electrode piece. A second fixed electrode includes third and fourth fixed electrode pieces, the third and fourth fixed electrode pieces facing each other with the second movable electrode piece disposed between the third and fourth fixed electrode pieces, the third fixed electrode piece facing the second movable electrode piece with a gap narrower than a gap between the fourth fixed electrode piece and the second movable electrode piece. A first fixed contact point is in contact with the movable contact point, the movable contact point moving in a first direction by an electrostatic attractive force between the movable electrode and the first fixed electrode. A second fixed contact point is in contact with the movable contact point, the movable contact point moving in a second direction opposite to the first direction by an electrostatic attractive force between the movable electrode and the second fixed electrode.

A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si.sub.1-x-yC.sub.xN.sub.y)-based layer.

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

For a small sensor produced through a MEMS process, when an electrode pad, wiring, or a shield layer is formed in a final step, it is difficult to nondestructively investigate whether a structure for sensing a physical quantity has been processed satisfactorily. In the present invention, in a physical quantity sensor formed from an MEMS structure, in a structure in which a surface electrode having through wiring is formed on the surface of an electrode substrate and the periphery thereof is insulated, forming a shield layer comprising a metallic material on the surface of the electrode substrate in a planar view and providing a space for internal observation inside the shield layer makes it possible to check for internal defects.

The present invention relates micro-electromechanical systems (MEMS); in particular to a comb channel structure for decreasing damping asymmetry of comb electrodes used to measure movement of components with MEMS devices. The channel is formed by a series of recesses formed in the comb fingers of the comb electrodes, or in the cap or handle wafer adjacent to the comb fingers. The channel increases the cross sectional area of the path through which gas can move into or out of the space between the comb electrodes as the comb electrodes move with respect to one another. Thus, when there is a damping asymmetry caused by a difference in the distance between the comb electrode and the cap wafer, and the comb electrode and handle wafer, the channel is employed on the side of the comb electrode with the smaller distance to the adjacent wafer to reduce the damping asymmetry.

A MEMS device includes a membrane comprising a first plurality of fingers. A counter electrode arrangement includes a second plurality of fingers disposed in a interdigitated relationship with the first plurality of fingers of the membrane. A deflector is configured to deflect the membrane such that the first and second plurality of fingers are displaced in a position excluding maximum overlapping of surfaces of the fingers.