According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

An injection molding die of the invention, includes: a cavity die having a molding recess formed thereon, the molding recess molding a molded-product main body on which a design surface of a resin molded product is formed; and a core die that exists to be openable and closable with respect to the cavity die and forms a cavity having the molding recess between the cavity die and the core die, when the core die is closed and coupled to the cavity die, and the injection molding die is used in a resin molding method of causing a design surface of the resin molded product during molding to be brought into close contact with the cavity die by setting temperatures of the cavity die and the core die to be higher than or equal to a deformation temperature of a resin to be molded.

An injection molding die of the invention, includes: a cavity die having a molding recess formed thereon, the molding recess molding a molded-product main body on which a design surface of a resin molded product is formed; and a core die that exists to be openable and closable with respect to the cavity die and forms a cavity having the molding recess between the cavity die and the core die, when the core die is closed and coupled to the cavity die, and the injection molding die is used in a resin molding method of causing a design surface of the resin molded product during molding to be brought into close contact with the cavity die by setting temperatures of the cavity die and the core die to be higher than or equal to a deformation temperature of a resin to be molded.

An apparatus for molding a part includes a plunger cavity, a plunger, and a mold cavity, wherein the plunger is oriented out-of-plane with respect to a major surface of the mold cavity, and first and second vents couples to respective first and second portions of the mold cavity. In a method, resin and fiber are forced into the mold cavity from a plunger cavity, and at least some of the fibers and resin are preferentially flowed to certain region in the mold cavity via the use of vents.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

A method of forming a molding tool includes performing a computer aided engineering (CAE) analysis on a molding tool design. The CAE analysis predicts flow of injection molded material and a location of gas entrapment within a molding recess of the molding tool design. At least one venting design constraint is applied to the molding tool design as a function of the gas entrapment location. Also, a biomimetic shaped passageway for venting gas away from the gas entrapment location is selected from a plurality of biomimetic shaped passageways. A computational fluid dynamic (CFD) CAE analysis of the molding tool design with the selected biomimetic shaped passageway is performed and modifications of the selected biomimetic shaped passageway are CFD CAE analyzed until a final biomimetic shaped passageway is determined and a molding tool with the final biomimetic shaped passageway is formed.

A shock-absorbing or vibration-absorbing assembly includes a metal base and an elastic shock-absorbing or vibration-absorbing material secured to the metal base. A top surface of the metal base has at least one orifice extending from the top surface to at least one hollow chamber beneath the top surface. The hollow chamber occupies a planar area of the metal base parallel to the top surface that is larger than a planar area of the metal base that is occupied by the orifice at the top surface. The elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that has a cross-sectional area parallel to the top surface of the metal base that is larger than the planar area of the metal base that is occupied by the orifice at the top surface of the metal base. The elastic material is secured to the metal base by placing the metal base against a mold having a hollow space to be filled with the elastic material. The elastic material is injected into the hollow chamber and orifice of the metal base and into the hollow space of the mold. The mold is removed from the metal base, so that the elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that corresponds to the hollow space of the mold.

A shock-absorbing or vibration-absorbing assembly includes a metal base and an elastic shock-absorbing or vibration-absorbing material secured to the metal base. A top surface of the metal base has at least one orifice extending from the top surface to at least one hollow chamber beneath the top surface. The hollow chamber occupies a planar area of the metal base parallel to the top surface that is larger than a planar area of the metal base that is occupied by the orifice at the top surface. The elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that has a cross-sectional area parallel to the top surface of the metal base that is larger than the planar area of the metal base that is occupied by the orifice at the top surface of the metal base. The elastic material is secured to the metal base by placing the metal base against a mold having a hollow space to be filled with the elastic material. The elastic material is injected into the hollow chamber and orifice of the metal base and into the hollow space of the mold. The mold is removed from the metal base, so that the elastic material is secured to the metal base by the elastic material filling the orifice and the hollow chamber of the metal base and the elastic material filling a region above the top surface of the metal base that corresponds to the hollow space of the mold.

A molding method includes providing a molding device, wherein the molding device includes a first mold and a second mold corresponding to the first mold; moving the first mold towards the second mold to form a first mold cavity; supplying a gas to the first mold cavity; injecting a material into the first mold cavity; and moving the first mold away from the second mold to form a second mold cavity and discharge at least a portion of the gas out of the molding device, wherein a first volume of the first mold cavity is substantially less than a second volume of the second mold cavity.