A low-cost, multi-function adhesive wireless communications and transducer platform with a form factor that unobtrusively integrates one or more transducers and one or more wireless communication devices in an adhesive product system. In an aspect, the adhesive product system integrates transducer and wireless communication components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the constituent components but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including sensing, notification, security, and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.

An adhesive silicone composition having (A) a linear or branched organopolysiloxane having at least two alkenyl groups in a molecule (B) an organopolysiloxane comprising R.sup.2.sub.3SiO.sub.1/2 units and SiO.sub.4/2 units, wherein R.sup.2 is, independently of each other, a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having no aryl group, and (E) an organohydrogenpolysiloxane having at least three hydrogen atoms each bonded to a silicon atom in a molecule and having an aryl group-containing organic group.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

The present invention provides a surface protective film which includes an adhesive layer on one surface of a substrate film, wherein the adhesive layer is a cured product of a composition containing: a urethane-based resin having a photoreactive group at the end or side chain thereof; a monofunctional (meth)acrylate monomer; a crosslinking agent having two or more photoreactive groups at the end thereof; a peel strength adjusting agent; and a photoinitiator, the composition being solvent-free; and the adhesive layer has peel strength of 0.5 gf/in to 10 gf/in, as measured on glass at a peel angle of 180° and a peel rate of 1.8 m/min.

A system includes a vacuum chuck; and a tape. The tape includes a flexible polymer substrate; and an adhesive die catching film disposed on the flexible polymer substrate facing a front surface of the flexible polymer substrate. The tape is held on the vacuum chuck by suction applied to a rear surface of the flexible polymer substrate.

Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 μm or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

An object of the present invention is to provide a pressure-sensitive adhesive composition that enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability and transparency while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive composition of the present invention contains an acrylic polymer (A), a mixture of monomer components constituting the acrylic polymer (A) or a partially polymerized product of a mixture of monomer components constituting the acrylic polymer (A), and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive composition comprises a branched-chain alkyl group having 10 to 24 carbon atoms as a monomer component. The hydrogenated polyolefinic resin (B) has a number average molecular weight (Mn) of 1000 to 5000 and a polydispersity (Mw/Mn) of 2.0 or less. The hydrogenated polyolefinic resin (B) contains at least one selected from the group consisting of a hydrogenated polyolefin and a hydrogenated polyolefin polyol. The pressure-sensitive adhesive composition comprises 3 to 35 parts by weight of the hydrogenated polyolefinic resin (B) based on 100 parts by weight of the acrylic polymer (A).